Polyimide composite conductive film and preparation method thereof
A polyimide, composite conductive technology, applied in the direction of equipment used to manufacture conductive/semiconductor layers, cable/conductor manufacturing, conductive layers on insulating carriers, etc. Adjustment and other issues to achieve the effect of convenient dipping of paint and convenient coating work
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
preparation example Construction
[0046] A kind of preparation method of polyimide composite conductive film, it is characterized in that: described preparation method comprises the following steps:
[0047] S1: Pickling, placing the polyimide polymer material base film in hydrochloric acid solution for 45 minutes, and then drying;
[0048] S2: Coating material preparation, adding dispersant, indium tin oxide, hydroxylated graphene, silicon dioxide and ferric oxide into deionized water, and ultrasonically dispersing evenly to prepare a coating solution;
[0049] S3: coating, the coating solution obtained in step S2 is evenly coated on the surface of the polyimide polymer material base film with a coating roller, and then dried to obtain a film loaded with a coating layer;
[0050] S4: conductive treatment, conducting conductive treatment of silver, copper or their alloys on the surface of the thin film loaded with the coating layer obtained in step S3 by using an electroplating process.
[0051]As an embodime...
Embodiment approach
[0052] As an embodiment of the present invention, in S2, the dispersant is triethylhexyl phosphoric acid and carboxymethyl cellulose.
[0053] As an embodiment of the present invention, in the S4, the electroplating solution used in the electroplating process is prepared by mixing and stirring 18% metal sulfate, 3% metal chloride and 3% boric acid.
[0054] As an embodiment of the present invention, in S4, during electroplating, it is necessary to control the temperature of the electroplating solution between 45°C and the pH value of the electroplating solution at 3.5; the current density is controlled at 3.2A / dm 2 , the electroplating time is controlled at 45 minutes, and metal silver, copper or titanium plates are used as catalytic electrodes.
[0055] As an embodiment of the present invention, in S3, the coating roller includes a connecting bracket 1, a brush roller 2, a rotating shaft 21 and an adjustment assembly 12; the rotating shaft 21 runs through the middle of the br...
PUM
| Property | Measurement | Unit |
|---|---|---|
| Thickness | aaaaa | aaaaa |
| Thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
Login to View More 


