High-speed optical waveguide switch chip packaging module
A technology of switching chips and packaging modules, which is applied in the direction of optical waveguide light guide, coupling of optical waveguide, light guide, etc. It can solve the problems of high precision of parts, large number of parts, and difficult alignment and coupling, etc., to achieve effective transmission, The effect of less signal reflection and good VSWR
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[0047] All features disclosed in this specification, or steps in all disclosed methods or processes, except for mutually exclusive features and / or steps, can be combined in any way, unless otherwise stated, can be used by other equivalent or similar Each feature is intended to be replaced by alternative features, that is, each feature is one example only of a series of equivalent or similar features, unless expressly stated otherwise.
[0048] see figure 1 , figure 2 , a high-speed optical waveguide switch chip packaging module in many embodiments of the present invention, including a metallized optical fiber 1, an upper cover 2, a mounting screw 3, an optical fiber array with a double-ended connector 4, a base 5, a monitoring through-core capacitor 6, Power supply feedthrough capacitor 7, first radio frequency connection ceramic substrate 8, optical waveguide chip 9, monitoring feedthrough capacitor connection ceramic substrate 10, first SMA radio frequency connector 11, fi...
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