Silicon-on-insulator LDMOS (Laterally Diffused Metal Oxide Semiconductor) transistor with multiple triangular buried layers
A silicon-on-insulating layer, triangular technology, applied in the direction of semiconductor devices, electrical components, circuits, etc., to achieve the effect of improving breakdown voltage, increasing current, and uniform distribution of lateral electric field
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Embodiment 1
[0024] Based on the above parameters, the thickness of the source region 1 and the drain region 4 are both 1 μm; the thickness of the silicon body 2 is 8 μm; the thickness of a single triangular buried oxide layer 5 is 10 μm, the bottom length is 22 μm, and the number is 5 ; The length of the fully buried oxide layer 6 is 110 μm; the doping concentration of the drift region is 4×10 14 cm -3 ; The simulation simulation obtains the silicon-on-silicon LDMOS transistor (referred to as MTBL SOI LDMOS, abbreviated as MTBL SOI) of the present invention with a plurality of triangular buried layers on the silicon film layer. The surface electric field varies with the lateral position curve, and is better than the traditional The performance of the silicon-on-insulator LDMOS transistor (referred to as CSOI LDMOS, abbreviated as CSOI) of the surface electric field on the silicon film layer with the lateral position curve is compared, such as figure 2 As shown, it can be seen that the i...
Embodiment 2
[0029] Change the height h (or thickness, i.e. the vertical distance from the vertex to the bottom of the triangular buried oxide layer) of the triangular buried oxide layer, and the remaining parameters are the same as those of Example 1;
[0030] like Image 6 As shown, as the height h of the multiple triangular buried oxide layers increases, the breakdown voltage of the device of the present invention first increases and then decreases. The optimum height of the triangular buried oxide layer is 10 μm, that is, h=10 μm.
Embodiment 3
[0032] Change the width d (or length, that is, the length of the bottom side of the triangular buried oxide layer) of the multiple triangular buried oxide layers, and the doping concentration of the drift region, and the remaining parameters are the same as those in Example 1;
[0033] like Figure 7 As shown, when the width d of the triangular buried oxide layer is constant, with the increase of the doping concentration of the drift region, the breakdown voltage of the device of the present invention first increases and then decreases; With the increase of d, the peak value of the breakdown voltage corresponding to each d decreases with the variation of the doping concentration in the drift region, but the peak difference is not significant when d is 16 μm, 20 μm and 22 μm.
[0034] like Figure 8 As shown, when the width d of the triangular buried oxide layer remains unchanged, with the increase of the doping concentration of the drift region, the on-resistance of the devic...
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