Sn-Bi-Ag series lead-free solder and preparation method thereof

A lead-free solder, ag1.5%-2% technology, used in welding equipment, welding/cutting media/materials, manufacturing tools, etc. The effect of good wetting, low cost and high conductivity

Pending Publication Date: 2022-05-31
XIAN UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Scholars at home and abroad have long focused on the study of lead-free alloy systems, such as Sn-Ag, Sn-Cu, Sn-Zn and Sn-In binary alloy systems and multi-element alloys developed on the basis of their corresponding binary alloy systems. However, The research results show t

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0027] Example 1:

[0028] The raw material composition of a Sn-Bi-Ag series lead-free solder for electronic assembly is: Bi 3%, Ag 1.5%, Cu 0.3%, Ni 0.05%, Zn 0.8%, Cr 0.4%, Ti 0.03%, Sn Bal, the sum of the mass percentages of the above components is 100%.

[0029] The brazing alloy is prepared according to the above-mentioned components and mass percentages, melted in a vacuum environment, and the vacuum degree is -0.1Mpa;

[0030] The preparation method of Sn-Bi-Ag lead-free solder for electronic assembly is specifically carried out according to the following steps:

[0031] Step 1, weigh 30g Bi, 930.92g Sn, 15g Ag into the crucible, smelt in a vacuum environment, the smelting temperature is 1200 ℃, after the raw materials are completely melted, keep the temperature for 25-65min, and stir once every 15min, take out Alloy A is obtained after pouring into the mold;

[0032] Step 2: Divide the alloy A into two equal parts, take one part and smelt with Cu 3g and Ni 0.5g in a...

Example Embodiment

[0036] Example 2:

[0037] The raw material composition of Sn-Bi-Ag lead-free solder for electronic assembly is: Bi 4%, Ag 1.6%, Cu 0.4%, Ni0.06%, Zn 0.9%, Cr 0.5%, Ti 0.05%, Sn Bal , the sum of the mass percentages of the above components is 100%.

[0038] The brazing alloy is prepared according to the above components and mass percentages, and melted in a vacuum environment with a vacuum degree of 0.1Mpa.

[0039] The preparation method of Sn-Bi-Ag lead-free solder for electronic assembly is specifically carried out according to the following steps:

[0040] Step 1, weigh 40g Bi, 924.9g Sn, 16g Ag into the crucible, smelt in a vacuum environment, the smelting temperature is 1200 ℃, after the raw materials are completely melted, keep the temperature for 25-65min, and stir once every 15min, take out Alloy A is obtained after pouring into the mold;

[0041] Step 2: Divide the alloy A into two equal parts, take one part and smelt it with Cu 4g and Ni 0.6g in a vacuum environm...

Example Embodiment

[0045] Example 3

[0046] The raw material composition of Sn-Bi-Ag lead-free solder for electronic assembly is: Bi 5%, Ag 1.7%, Cu 0.5%, Ni0.07%, Zn 0.10%, Cr 0.6%, Ti 0.06%, Sn Bal , the sum of the mass percentages of the above components is 100%.

[0047] The brazing alloy is prepared according to the above components and mass percentages, and melted in a vacuum environment with a vacuum degree of 0.05Mpa.

[0048] The preparation method of Sn-Bi-Ag lead-free solder for electronic assembly is specifically carried out according to the following steps:

[0049] Step 1, weigh 50g Bi, 919.7g Sn, 17g Ag into the crucible, smelt in a vacuum environment, the smelting temperature is 1200 ℃, after the raw materials are completely melted, keep the temperature for 25-65min, and stir once every 15min, take out Alloy A is obtained after pouring into the mold;

[0050] Step 2: Divide Alloy A into two equal parts, take one part and smelt with Cu 5g and Ni 0.7g in a vacuum environment. The...

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Abstract

The invention discloses Sn-Bi-Ag system lead-free solder for electronic assembly and a preparation method of the Sn-Bi-Ag system lead-free solder. The Sn-Bi-Ag system lead-free solder comprises, by mass, 3%-8% of Bi, 1.5%-2% of Ag, 0.3%-0.6% of Cu, 0.05%-1% of Ni, 0.8%-1.3% of Zn, 0.4%-0.7% of Cr, 0.03%-0.6% of Ti and Sn Bal, and the sum of the mass percentages of the components is 100%. The Sn-Bi-Ag lead-free solder alloy for electronic assembly prepared by the invention has the advantages of lower melting point, smaller wetting angle, excellent mechanical properties such as tensile strength and the like, and better electric conductivity, so that the Sn-Bi-Ag lead-free solder alloy has better spreading and wetting properties on a substrate, low cost and high production efficiency, can be used for automatic mass production, is nontoxic and pollution-free in the production process, and has smaller influence on the environment.

Description

technical field [0001] The invention belongs to the field of lead-free solder for electronic assembly, and particularly relates to Sn-Bi-Ag series lead-free solder. [0002] The invention also relates to a preparation method of Sn-Bi-Ag series lead-free solder. Background technique [0003] With the rapid development of modern industry, the electronic technology industry in my country and even in the world is advancing by leaps and bounds, which has attracted widespread attention in various industries in various countries. Electronic products are the cornerstone of the electronic technology industry, and their design and processing are the top priority. Brazing is the core technology to realize the assembly of electronic components and substrates. As a raw material, the trend of high efficiency, rationalization and ecologicalization of solder is irresistible. Tin-lead solder is currently the most widely used solder because of its low price, wide source of raw materials, go...

Claims

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Application Information

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IPC IPC(8): B23K35/02B23K35/26B23K35/28B23K35/40
CPCB23K35/0222B23K35/282B23K35/264B23K35/40Y02E10/50
Inventor 张敏王新宝高俊张志强尚静李毅
Owner XIAN UNIV OF TECH
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