Sn-Bi-Ag series lead-free solder and preparation method thereof
A lead-free solder, ag1.5%-2% technology, used in welding equipment, welding/cutting media/materials, manufacturing tools, etc. The effect of good wetting, low cost and high conductivity
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Embodiment 1
[0028] The raw material composition of a Sn-Bi-Ag series lead-free solder for electronic assembly is: Bi 3%, Ag 1.5%, Cu 0.3%, Ni 0.05%, Zn 0.8%, Cr 0.4%, Ti 0.03%, Sn Bal, the sum of the mass percentages of the above components is 100%.
[0029] The brazing alloy is prepared according to the above-mentioned components and mass percentages, melted in a vacuum environment, and the vacuum degree is -0.1Mpa;
[0030] The preparation method of Sn-Bi-Ag lead-free solder for electronic assembly is specifically carried out according to the following steps:
[0031] Step 1, weigh 30g Bi, 930.92g Sn, 15g Ag into the crucible, smelt in a vacuum environment, the smelting temperature is 1200 ℃, after the raw materials are completely melted, keep the temperature for 25-65min, and stir once every 15min, take out Alloy A is obtained after pouring into the mold;
[0032] Step 2: Divide the alloy A into two equal parts, take one part and smelt with Cu 3g and Ni 0.5g in a vacuum environment. ...
Embodiment 2
[0037] The raw material composition of Sn-Bi-Ag lead-free solder for electronic assembly is: Bi 4%, Ag 1.6%, Cu 0.4%, Ni0.06%, Zn 0.9%, Cr 0.5%, Ti 0.05%, Sn Bal , the sum of the mass percentages of the above components is 100%.
[0038] The brazing alloy is prepared according to the above components and mass percentages, and melted in a vacuum environment with a vacuum degree of 0.1Mpa.
[0039] The preparation method of Sn-Bi-Ag lead-free solder for electronic assembly is specifically carried out according to the following steps:
[0040] Step 1, weigh 40g Bi, 924.9g Sn, 16g Ag into the crucible, smelt in a vacuum environment, the smelting temperature is 1200 ℃, after the raw materials are completely melted, keep the temperature for 25-65min, and stir once every 15min, take out Alloy A is obtained after pouring into the mold;
[0041] Step 2: Divide the alloy A into two equal parts, take one part and smelt it with Cu 4g and Ni 0.6g in a vacuum environment. The smelting tem...
Embodiment 3
[0046] The raw material composition of Sn-Bi-Ag lead-free solder for electronic assembly is: Bi 5%, Ag 1.7%, Cu 0.5%, Ni0.07%, Zn 0.10%, Cr 0.6%, Ti 0.06%, Sn Bal , the sum of the mass percentages of the above components is 100%.
[0047] The brazing alloy is prepared according to the above components and mass percentages, and melted in a vacuum environment with a vacuum degree of 0.05Mpa.
[0048] The preparation method of Sn-Bi-Ag lead-free solder for electronic assembly is specifically carried out according to the following steps:
[0049] Step 1, weigh 50g Bi, 919.7g Sn, 17g Ag into the crucible, smelt in a vacuum environment, the smelting temperature is 1200 ℃, after the raw materials are completely melted, keep the temperature for 25-65min, and stir once every 15min, take out Alloy A is obtained after pouring into the mold;
[0050] Step 2: Divide Alloy A into two equal parts, take one part and smelt with Cu 5g and Ni 0.7g in a vacuum environment. The smelting temperatur...
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