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PTH hole forming method

A hole forming and pre-drilling technology, which is applied to the formation of electrical connection of printed components, printed circuits where non-printed electrical components are connected, and printed circuit manufacturing, etc. and other problems to achieve the effect of improving the molding quality and ensuring the cleaning effect.

Pending Publication Date: 2022-06-17
科惠白井(佛冈)电路有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the actual implementation process, the above scheme needs to consume more power or chemical resources, which is not conducive to the cost control of the copper plating process in the PTH hole forming process

Method used

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  • PTH hole forming method

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Embodiment Construction

[0020] The present application will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the following exemplary embodiments and descriptions are only used to explain the present invention, but not to limit the present invention, and, in the case of no conflict, the embodiments in this application and the features in the embodiments can be combined with each other .

[0021] like figure 1 As shown, an optional embodiment of the present invention provides a PTH hole forming method, comprising the following steps:

[0022] S1: Pre-drilled holes are drilled on the PCB board after the dry film process is completed;

[0023] S2: Wet the pre-drilled holes with deionized water;

[0024] S3: transfer and soak the pre-drilled PCB board into a degreaser diluent until the oil on the surface of the PCB board is fully dissolved; and;

[0025] S4: Transfer the PCB with the surface oil fully dissolved to a...

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PUM

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Abstract

The embodiment of the invention provides a PTH hole forming method, which comprises the following steps of: drilling a pre-drilled hole in a PCB (Printed Circuit Board) subjected to a dry film process, wetting the pre-drilled hole with deionized water, transferring the PCB subjected to hole wetting into a degreaser diluent, soaking until greasy dirt is fully dissolved, and removing the degreaser diluent from the PCB. And finally, transferring the PCB of which the oil stain on the surface is fully dissolved into a copper plating cylinder containing electroplating liquid for electroplating, so that a copper plating layer with a preset thickness is formed on the hole wall of the pre-drilled hole to obtain the PTH hole. According to the embodiment of the invention, the pre-drilled hole is wetted by using the deionized water to fully discharge air in the pre-drilled hole, so that the problem that a circuit cannot be conducted smoothly due to copper shortage of a hole wall caused by air obstruction remained in the hole is avoided; in addition, an oil removal process is added before an electroplating copper plating process, subsequent copper plating failure caused by oil stain attachment is avoided, finally, copper plating operation is carried out, and a PTH hole is obtained after a copper plating layer with a preset thickness is formed on the hole wall of the pre-drilled hole.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of PCB board processing, and in particular, to a PTH hole forming method. Background technique [0002] The PCB board usually contains a multi-layer circuit structure. The circuits of different layers need to be electrically connected by opening PTH holes. During the PTH hole forming process, copper plating on the inner wall of the pre-drilled hole is one of the important processes to ensure circuit continuity. one. [0003] However, with the development of PCB boards towards fine lines, high density, multi-layer, and miniaturization, the aperture of PTH holes is getting smaller and smaller, so that the aspect ratio of PTH holes is getting larger and larger. When the aspect ratio of the PTH hole is larger, it is more difficult for the electroplating solution to enter the pre-drilled hole, so that the air in the hole cannot be completely discharged, and the air remaining in the pre-dril...

Claims

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Application Information

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IPC IPC(8): C25D3/38C25D5/34C25D7/00H05K1/18H05K3/00H05K3/42
CPCC25D3/38C25D5/34C25D7/00H05K1/182H05K3/0047H05K3/422
Inventor 罗家亮梅正中曾英才
Owner 科惠白井(佛冈)电路有限公司