Preparation of black alumina substrate for multilayered wiring

A technology of black alumina and multi-layer wiring, applied in the direction of electrical components, impedance networks, etc., can solve the problems of high cost, demanding processing technology, high alumina sintering temperature, etc., to reduce equipment requirements, simple process, reduce The effect of firing temperature

Inactive Publication Date: 2009-07-15
HUAZHONG UNIV OF SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Disadvantages: the sintering temperature of alumina is very high, the processing process is demanding, and the cost is high

Method used

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  • Preparation of black alumina substrate for multilayered wiring
  • Preparation of black alumina substrate for multilayered wiring
  • Preparation of black alumina substrate for multilayered wiring

Examples

Experimental program
Comparison scheme
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preparation example Construction

[0038] The preparation method of Wu electrode slurry is: adding Al to metal tungsten powder 2 o 3 Base ceramic powder and add a little organic carrier dropwise, and grind while adding dropwise. The amount of organic carrier should be such that a small amount of the ground slurry can be pulled out of fine sticky filaments or a large amount can be pulled into a film. Among them, the mass percentage of metal tungsten powder is 83wt% ~ 86wt%, Al 2 o 3 The mass percentage of the base ceramic powder is 12wt%-15wt%, the mass percentage of the organic vehicle is 1wt%-3wt%, and the Wu electrode slurry is finally prepared by fully grinding in a mortar. The organic carrier is composed of ethyl cellulose, terpineol, and dibutyl phthalate, among which, 19ml~21ml terpineol and 2ml~5ml dibutyl phthalate are added to each 1g of ethyl cellulose, and the water bath Heat and stir evenly to dissolve all the ethyl cellulose to make an organic carrier.

[0039] (5) Multi-layer co-firing:

[00...

example 1

[0042] Doping modification reduces the sintering temperature of alumina to prepare the process of casting powder: Weigh the total mass of powder as 10g, Al 2 o 3 8.69g, Co 2 o 3 0.05g, MnO 2 0.37g, Cr 2 o 3 0.21g, SiO 2 0.45g,TiO 2 0.2g, V 2 o 50.03g. Put the weighed powder into a ball mill jar, add alcohol as a medium for planetary ball milling, and mix well for 3 hours. Then dry and pass through an 80-mesh sieve. Add an appropriate amount of 10% PVA polyvinyl alcohol for granulation, put it into a tablet press for tablet molding at a pressure of 15 MPa, and then sinter in air at 1350°C for 2 hours to obtain a dense black alumina ceramic body.

[0043] SiO 2 The SEM picture when the content is 4.5% figure 1 . It can be seen that the grains are fine and uniform, the average grain size is about 2.5 μm, and no flaky grains are formed. Test its physical and electrical properties to get SiO 2 The relationship between content and density and porosity is as fol...

example 2

[0045] The same technological process as scheme 1, the total mass of the powder is weighed to be 10g, Al 2 o 3 8.99g, Co 2 o 3 0.05g, MnO 2 0.37g, Cr 2 o 3 0.21g, SiO 2 0.15g, TiO 2 0.2g, V 2 o 5 0.03g. Put the weighed powder into a ball mill jar, add alcohol as a medium for planetary ball milling, and mix well for 3 hours. Then dry and pass through an 80-mesh sieve. Add an appropriate amount of 10% PVA for granulation, put it into a tablet press for tablet molding at a pressure of 15 MPa, and then sinter in air at 1350°C for 2 hours to obtain a dense black alumina ceramic body.

[0046] SiO 2 When the content of SiO is in the range of 0.5wt%-6.5wt%, SiO 2 The addition of black Al 2 o 3 The effect of ceramic porcelain body color is minimal. W(SiO 2 )% = 1.5%, the density of sintered porcelain is 3.78g / cm 3 , the porosity is 0.12%, and the insulation resistivity is 2.5×10 10 Ω.cm, when the frequency is 10kHz, the measured relative permittivity ε r =13.6...

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Abstract

The present invention discloses a method for preparing material of black alumina substrate used in multilayer wiring, namely adopts solid phase method, adds elements of Co, Mn, Cr, Si, Ti, B, V etc. into principal crystalline phase Al2O3 powder, modify oxide of alumina through adulterating, which recedes firing temperature, and brings out a black oxide of alumina organic doctor-blade casting method on the basis of modified powder, selects doctor-blade casting agent, double solvent and composite plasticizer that suitable for oxide of alumina; uniform and stable slurry with high solid content is obtained, bisque forming quality is enhanced; use doctor blade method for tape-casting, equipment simple and operational, natural drying process convenient, drying process will not lead rupture of billet body and phenomenon of unable stripping; obtained film body compact, and use mechanical drilling method to prepare stack basal lamina and obtain black alumina substrate used in multilayer wiring.

Description

technical field [0001] The invention belongs to the field of ceramic material science and technology, and relates to a material for a ceramic base of a quartz crystal resonator for surface mounting—a method for preparing a black alumina substrate for multilayer wiring. Background technique [0002] At present, in the field of packaging, ceramic substrates still occupy an important position. Packaging technology continues to develop toward integration, miniaturization, and precision, so the research on ceramic substrates for multilayer wiring has attracted much attention. In the high-tech field, such as the surface mount quartz crystal resonator base used in high-end electronic products such as mobile phones and notebook computers, the main crystal phase material is alumina. The production process is that 4 layers of tape-cast green sheets are laminated into a whole at 60-120°C and a pressure of 5-30MPa, and tungsten electrodes are printed on each layer of green sheets, and ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H03H3/007C04B35/10C04B35/622
Inventor 周东祥赵俊龚树萍胡云香郑志平刘欢傅邱云
Owner HUAZHONG UNIV OF SCI & TECH
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