Packaging structure of photoelectric module and photoelectric module using packaging structure

Abstract

The invention discloses a packaging structure of a photoelectric module and the photoelectric module using the packaging structure, the packaging structure comprises a centrosymmetric substrate, one surface of the substrate is provided with a plurality of light emitting / receiving devices and a driver, and the other surface of the substrate is provided with a plurality of electrical contacts; the electrical contacts comprise a plurality of first contacts and a plurality of second contacts, the second contacts are arranged on the peripheries of the first contacts, intervals are arranged between the second contacts, and the surface area of the first contacts is larger than that of the second contacts. The photoelectric module can be suitable for different types of optical assemblies. According to the invention, the base is directly used for installing the light emitting / receiving device, and the assembly process is simple; a plurality of electrical contacts are arranged on the back surface of the substrate and are suitable for a reflow soldering surface mounting process; the optical assembly is protected through the protective cover, injection molding materials can be prevented from entering the inner cavity, and the device is suitable for different modes and is flexible and simple in structure.

Description

technical field [0001] The invention relates to the field of optical communication, in particular, to a packaging structure of an optoelectronic module and an optoelectronic module using the packaging structure, which simplifies the assembly process. Background technique [0002] As the density and integration of communication electronic devices increase, optical transceiver modules are required to have smaller size packages. [0003] The common method in the industry is to encapsulate the chip in the secondary PCBA, connect the secondary PCBA to the optical fiber connector, and then assemble them together on the main PCB. The secondary PCB has certain versatility. Although this structure omits the conversion of the lens optical path, it limits the optical coupling between the secondary PCBA and the fiber optic connector to use only active coupling, which requires longer coupling time than passive coupling, and is more efficient in production. Low. And the main PCBA and t...

AI Technical Summary

Problems solved by technology

However, in this type of transceiver integrated optical module, the optical transceiver device and the printed circuit board are installed in the base, and the optical transceiver device needs a fixed position provided by the base, otherwise the coupling and alignment with the optical fiber cannot be completed.

This structure has many parts and complex assembly

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