Copper surface super-coarsening solution for circuit board as well as preparation method and application of copper surface super-coarsening solution

Abstract

The invention discloses a copper surface super-roughening solution for a circuit board as well as a preparation method and application of the copper surface super-roughening solution, and relates to the field of circuit board manufacturing. The coarsening solution comprises 70-200 g / L of sulfuric acid, 20-60 g / L of hydrogen peroxide, 2-18 g / L of a coarsening homogenizing agent, 1.2-9.8 g / L of a coarsening and stabilizing agent, 2-18 g / L of an antioxidant and water as a solvent. The coarsening homogenizing agent is selected from at least one of methoxylated polyethylene glycol and cyclohexanone; the coarsening and stabilizing agent is selected from at least one of 1, 4-butanediol, 2-acetamido-5-sulfydryl-1, 3, 4-thiadiazole, and 2-sulfydryl-1-methylimidazole; the antioxidant is selected from at least one of acetic acid and butanol phosphate. According to the copper surface super-coarsening solution for the circuit board, all the components are matched with one another, and the preparation method and application are combined, so that the super-coarsening solution is stable, the coarsening effect meets the requirements of dry film pasting in a subtraction method (negative film method) production process, copper surface oxidation is reduced, and the AOI detection efficiency in a negative film production process is improved.

Description

technical field [0001] The invention relates to the field of circuit board manufacturing, in particular to a copper surface ultra-roughening solution for circuit boards, a preparation method and applications thereof. Background technique [0002] In the manufacturing process of the circuit board, the copper surface must be treated before the resist coating or anti-corrosion film is applied in the circuit process. The traditional copper surface treatment is a mechanical grinding or chemical micro-etching process. Cleaning and chemical micro-etching only remove the oxide layer on the copper surface, and the degree of roughening is very small. When the circuit density is not large, because the contact area between the film and the copper surface is large, the bonding force can generally meet the requirements. [0003] Now, with the pursuit of light, thin, short, and small electronic products with high-integration design, circuit boards are gradually developing towards high-dens...

AI Technical Summary

Problems solved by technology

However, the increase in the process leads to an increase in cost and an increase in the risk of line scratches

[0006] Another super-coarsening process of the system is inorganic acid super-coarsening of sulfuric acid-hydrogen peroxide series. The advantage of this type of super-coarsening is that the treatment cost is low, but it often has low roughening degree, unstable roughening solution, and copper surface The phenomenon of easy oxidation, if it is used in the pretreatment of the subtractive method (negative film method), it is necessary to further improve the roughening rate, roughening stability and oxidation resistance of the copper surface

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