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MEMS system and signal processing circuit

A signal processing module and signal technology, applied in the direction of electrostatic transducer microphones, etc., can solve the problems of high signal-to-noise ratio, difficult to meet, limited performance of MEMS microphones, etc., and achieve the effect of improving signal-to-noise ratio and improving performance.

Pending Publication Date: 2022-07-01
HANGZHOU SILAN MICROELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] However, the traditional capacitive MEMS microphone with single-layer diaphragm and single-layer backplane has limited performance, and it is difficult to meet the requirements of increasingly high signal-to-noise ratio (SNR). To make a MEMS microphone with a higher SNR, it is necessary with updated design

Method used

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  • MEMS system and signal processing circuit
  • MEMS system and signal processing circuit

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Experimental program
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Embodiment 1

[0055] figure 1 This is a structural block diagram of the MEMS system provided in this embodiment. like figure 1 As shown, the MEMS system includes a bias voltage generating module 10 , a differential capacitive MEMS sensing module 20 , a signal processing module and a clock signal generating module 40 . The clock signal generation module 40 provides the clock signal Clk for the MEMS system, and although the clock signal generation module 40 in this embodiment is an internal clock module, as an optional embodiment, the clock signal generation module 40 may also be an external clock module, and the specific connection manner of the clock signal generation module 40 will be described below.

[0056] The bias voltage generation module 10 is used to generate N bias voltages, where N is greater than or equal to 2. In this embodiment, N=2, and the bias voltage generation module 10 has two output terminals, each of which outputs a bias voltage. The two bias voltages are the bias v...

Embodiment 2

[0113] Image 6 This is a structural block diagram of the MEMS system provided in this embodiment. like Image 6As shown, the difference from the first embodiment is that, in this embodiment, the bias voltage generating module 10 generates N bias voltages, and the MEMS unit, the signal processing module and the first high-resistance unit all have N, and N>2. The N MEMS units are all connected to the bias voltage generating module 10, the differential capacitance of each MEMS unit is connected to one of the bias voltages, and the N MEMS units are connected to the bias voltage according to the first common mode signal Vcom1, The capacitance variation generated by the N differential capacitors and the N bias voltages output N first voltage signals representing the sound signal, and the N first voltage signals are output through the N output terminals. The N signal processing modules are respectively connected to the N MEMS units, access the N first voltage signals and perform ...

Embodiment 3

[0118] Figure 7 This is a structural block diagram of the MEMS system provided in this embodiment. like Figure 7 As shown, the difference from Embodiment 1 and Embodiment 2 is that in this embodiment, the gain adjustment unit 322 is a single-ended input and double-ended output gain adjustment unit, so the two outputs of the gain adjustment unit 322 The terminal outputs differential signals Voutm and Voutp.

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Abstract

The invention provides an MEMS system and a signal processing circuit, a differential capacitance type MEMS sensing module outputs N first voltage signals representing sound signals according to a first common-mode voltage, capacitance variation generated by N differential capacitors and N bias voltages, N signal processing modules are respectively connected with N output ends of the differential capacitance type MEMS sensing module, n first voltage signals are connected and processed, the output end of the ith signal processing module is connected with the (i + 1) th differential capacitor, that is, the output signal of each signal processing module is superposed to the input end of the next differential capacitor, so that signal superposition is realized, and the output signal of the ith signal processing module is converted into the output signal of the (i + 1) th differential capacitor. The amplitude of the second voltage signal output by the last signal processing module is enhanced in a multi-stage cascading mode, and other noise is not introduced, so that the signal-to-noise ratio of the MEMS system can be improved, and the performance of the MEMS system is further improved.

Description

technical field [0001] The invention relates to the technical field of micro-microphones, in particular to a MEMS system and a signal processing circuit. Background technique [0002] The capacitive MEMS microphone is a MEMS (Micro-Electro-Mechanical System, micro-electromechanical system) device manufactured by a micro-machining process. Due to the advantages of small size, high sensitivity, and good compatibility with existing semiconductor technologies, capacitive MEMS microphones are more and more widely used in mobile terminals such as mobile phones. [0003] The structure of the capacitive MEMS microphone has a vibrating membrane, a back plate electrode and a supporting wall, the supporting wall encloses a cavity, the back plate electrode is located on the supporting wall and covers the cavity, and the vibrating membrane is suspended in the cavity and the edge extends to Fixed in the support wall. When the vibrating membrane feels the external excitation signal, the ...

Claims

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Application Information

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IPC IPC(8): H04R19/04
CPCH04R19/04H04R2201/003
Inventor 周延青胡铁刚潘华兵郑泉智
Owner HANGZHOU SILAN MICROELECTRONICS