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Silicon-aluminum alloy packaging box body and manufacturing method thereof

A technology of silicon-aluminum alloy and manufacturing method, which is applied in the field of silicon-aluminum alloy packaging box and its manufacturing, can solve the problems of cover offset, affecting product quality, and high welding difficulty, so as to ensure flatness, improve welding quality, and improve The effect of production quality

Pending Publication Date: 2022-07-08
江苏华能节能科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the related technologies mentioned above, the inventor believes that when the cover and the box body are welded and connected, the cover is easily affected by false touch or welding stress and will be offset, and the welding is difficult, which will affect the product quality

Method used

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  • Silicon-aluminum alloy packaging box body and manufacturing method thereof
  • Silicon-aluminum alloy packaging box body and manufacturing method thereof
  • Silicon-aluminum alloy packaging box body and manufacturing method thereof

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Embodiment Construction

[0047] Attached to the following Figure 1-5 This application will be described in further detail.

[0048] The embodiment of the present application discloses a silicon aluminum alloy packaging box. refer to figure 1 A silicon-aluminum alloy packaging box includes a box body 1 and a cover 2, one side of the box body 1 is provided with a connection opening 11, and the peripheral edge of the box body 1 close to the connection opening 11 is provided with a positioning step for the cover 2 to be placed 13, the cover 2 is located on the positioning step 13, the inner side wall of the positioning step 13 is in contact with the circumferential side wall of the cover 2, the cover 2 and the box body 1 are brazed and fixed, and the cover 2 is used to seal the box The connection opening 11 of the body 1. An accommodating cavity 12 is formed in the area surrounded by the box body 1 and the cover 2 , and a protective gold layer is electroplated on the inner wall of the accommodating ca...

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PUM

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Abstract

The invention relates to a silicon-aluminum alloy packaging box body and a manufacturing method thereof, and relates to the field of silicon-aluminum alloy box bodies, and the manufacturing method comprises the following steps: smelting, mixing and proportioning raw materials; performing spray deposition to prepare a blank; preparing the silicon-aluminum alloy molten mixture into a silicon-aluminum alloy round ingot blank through a spray deposition method; densification treatment: carrying out static pressure densification treatment on the silicon-aluminum alloy round ingot blank; cutting: cutting the silicon-aluminum alloy round ingot blank into a sealing cover plate blank and a box body plate blank; machining is conducted, specifically, the sealing cover plate blank and the box body plate blank are machined, and a required sealing cover and a required box body are obtained; coating is conducted; plating protective gold layers on the inner side walls of the box body and the sealing cover; welding is conducted; the box body and the sealing cover are connected in a welded mode; and inspecting. The welding quality and the air tightness of the packaging box body are effectively improved, and the packaging box body has good mechanical supporting and protecting capacity.

Description

technical field [0001] The application relates to the field of silicon-aluminum alloy boxes, and in particular, to a silicon-aluminum alloy package box and a manufacturing method thereof. Background technique [0002] The electronic packaging box provides electrical or thermal paths, mechanical support and environmental protection for the chip. It is the basis for the stable performance and high reliability of the components. It not only requires good mechanical and thermophysical properties, but also needs to meet the requirements of machining, surface coating and laser processing. Welding and other process requirements. [0003] The related electronic packaging box body includes a box body and a cover, one side of the box body is provided with a connection opening, and the cover is welded and fixed to the end face of the box body near the connection opening and is located outside the box body. The cover is used to close the connection opening. [0004] In view of the abo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K5/02B23P15/00
CPCH05K5/0217B23P15/00Y02W30/80
Inventor 徐建康
Owner 江苏华能节能科技有限公司