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Foamed polyphenyl ether polypropylene composite bead and wafer packaging box

A technology of polypropylene and polyphenylene ether, which is applied in the field of foamed polyphenylene ether polypropylene composite beads and wafer packaging boxes, can solve problems such as the difficulty in realizing the integrated design of wafer packaging boxes, and achieve automatic packaging solutions, Fewer consumables, realize the effect of integrated design

Pending Publication Date: 2022-07-12
WUXI HI TEC ENVIRONMENTAL MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The technical problem to be solved by the present invention is: in order to solve the problem that it is difficult to realize the integrated design of the wafer packaging box in the prior art, the present invention provides a foamed polyphenylene ether polypropylene composite bead and a wafer packaging box, based on the The excellent comprehensive performance of the polyphenylene ether polypropylene composite beads makes it possible to realize the integration of FOSB packaging when the polyphenylene ether polypropylene composite beads are used as the material of the wafer packaging box, which solves the difficulty in realizing wafer packaging in the prior art. The problem of the integrated design of the packaging box

Method used

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  • Foamed polyphenyl ether polypropylene composite bead and wafer packaging box
  • Foamed polyphenyl ether polypropylene composite bead and wafer packaging box
  • Foamed polyphenyl ether polypropylene composite bead and wafer packaging box

Examples

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Effect test

Embodiment 1

[0062] This embodiment provides a wafer packaging box, which is prepared from foamed polyphenylene ether polypropylene composite beads by steam molding; the foamed polyphenylene ether polypropylene composite beads are made of composite beads through physical Obtained by foaming; wherein the composite beads are composed of a core layer and a skin layer; the composite beads are prepared by co-extrusion composite granulation process, wherein the core layer processing screw temperature: 40 / 165 / 265 / 270 / 275 / 275 / 275 / 275 / 270 / 270 / 270 / 270, melt pressure: 2.1-2.3; skin processing screw temperature: 160 / 165 / 185 / 220 / 225 / 225 / 225 / 225 / 220 / 220 / 220 / 220, melt pressure : 2.2-2.5.

[0063] In parts by weight, the core layer includes the following components:

[0064]

[0065] The skin layer is polypropylene, the melting point is 149°C, and the melt index is 4-6g / 10min.

[0066] The thickness of the skin layer of the prepared composite beads is 12 μm, the diameter of the core layer is 1.5 mm,...

Embodiment 2

[0071] The difference between this embodiment and Embodiment 1 is:

[0072] In parts by weight, the core layer includes the following components:

[0073]

[0074]

[0075] The performance of the prepared wafer packaging box was tested, and the data are shown in Table 1.

Embodiment 3

[0077] This embodiment provides a wafer packaging box, which is prepared from foamed polyphenylene ether polypropylene composite beads by steam molding; the foamed polyphenylene ether polypropylene composite beads are made of composite beads through physical Obtained by foaming; wherein the composite beads are composed of a core layer and a skin layer; the composite beads are prepared by co-extrusion composite granulation process, wherein the core layer processing screw temperature: 40 / 165 / 265 / 270 / 275 / 275 / 275 / 275 / 270 / 270 / 270 / 270, melt pressure: 2.1-2.3; skin processing screw temperature: 160 / 165 / 185 / 220 / 225 / 225 / 225 / 225 / 220 / 220 / 220 / 220, melt pressure : 2.0-2.2.

[0078] In parts by weight, the core layer includes the following components:

[0079]

[0080] The skin layer is polypropylene with a melting point of 145°C and a melt index of 5-7g / 10min.

[0081] The thickness of the skin layer of the prepared composite beads is 13 μm, the diameter of the core layer is 1.3 mm, ...

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Abstract

The invention provides foamed polyphenyl ether polypropylene composite beads and a wafer packaging box, and relates to the technical field of materials. The foamed polyphenyl ether polypropylene composite beads are obtained by physically foaming composite beads; each composite bead is composed of a core layer and a surface layer wrapping the outer side of the core layer. The polyphenyl ether-polypropylene composite bead provided by the invention has a composite structure that the surface layer coats the core layer, and the core layer is matched with the surface layer, so that the foamed polyphenyl ether-polypropylene composite bead has both rigidity and buffering performance and has permanent antistatic performance; therefore, the polyphenyl ether polypropylene composite bead can meet the performance requirements of all structures of the wafer packaging box at the same time, the integrated design of the wafer packaging box can be achieved, consumables needed by packaging are few, packaging steps are simple, and an automatic packaging scheme can be achieved.

Description

Technical field [0001] The invention relates to the field of material technology, and in particular to a foamed polyphenylene ether polypropylene composite beads and a wafer packaging box. Background technique [0002] Fully transparent wafer packaging box (FOSB) is used to carry wafers and transport wafers to downstream wafer fabs / chip factories; wafer packaging boxes need to be able to protect, transport, and store wafers, and prevent wafer collisions , friction; when transporting and storing wafers, it is necessary to provide safety protection and good air density to prevent the generation of particulate matter. [0003] Due to the harsh environmental conditions required for wafer transportation, it is difficult for existing materials to achieve the above functions at the same time. Therefore, the existing packaging solutions for FOSB boxes are relatively complex. Generally, an anti-static transparent bag needs to be placed outside the FOSB box, and then A pair of top an...

Claims

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Application Information

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IPC IPC(8): C08L71/12C08L23/12C08L25/06C08J9/16C08J9/228B65D6/14B65D43/02B65D55/02
CPCC08J9/16C08J9/228B65D11/00B65D43/02B65D55/02C08J2371/12C08J2425/06C08J2323/12C08J2423/12C08J2471/12Y02W30/80
Inventor 叶明郑广通陈坤曾佳朱民
Owner WUXI HI TEC ENVIRONMENTAL MATERIAL CO LTD
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