Polyimide film as well as preparation method and application thereof

A technology of polyimide film and polyamic acid, which is used in identification devices, instruments, etc., can solve problems such as difficulty in taking into account film transparency and adhesion.

Pending Publication Date: 2022-07-22
SHANGHAI 3F NEW MATERIAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0012] Although prior art has carried out various researches to polyimide film, when the thickness of film reaches a certain level, existing method is difficult to take into account the transparency (the amount of low PMDA) of film and the bonding property of film all the time. Contradiction

Method used

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  • Polyimide film as well as preparation method and application thereof
  • Polyimide film as well as preparation method and application thereof
  • Polyimide film as well as preparation method and application thereof

Examples

Experimental program
Comparison scheme
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Embodiment

[0058] The present invention will be described below with reference to specific embodiments. It should be noted that the following embodiments are examples of the present invention, and are only used to illustrate the present invention, but not to limit the present invention. Other combinations and various modifications within the inventive concept can be made without departing from the spirit or scope of the inventions.

[0059] experiment method

[0060] Solution Viscosity Test:

[0061] Solution viscosity was measured at 25°C using a Brookfield DV-I viscometer.

[0062] Dimensional Stability Test:

[0063] The change in film size with temperature was measured by a thermomechanical analyzer (TMA) model TA-Q400 with the sample heated at a rate of 10°C / min from 0°C to 500°C in a nitrogen atmosphere.

[0064] Film forming performance test:

[0065] The state of the polyimide film on the glass substrate and its bonding with the glass substrate were observed.

[0066] The...

Embodiment 1

[0071] The polyimide film is prepared from the BPDA / PMDA / pPDA copolymer by the temperature-programmed method of the present invention

[0072] The solution of polyamic acid was prepared by normal feeding method, and BPDA and PMDA in corresponding molar amounts were added to a glass bottle filled with N-methylpyrrolidone (NMP) and infused with nitrogen atmosphere, and the corresponding molar amounts of BPDA and PMDA were added after stirring at room temperature for 15 minutes. pPDA monomer, continue to add NMP solvent to ensure that there is no residual monomer on the inner wall of the container, and dilute to a solid content of 10wt% in the solution. The molar ratio of each monomer is shown in Table 1.

[0073] The obtained polyamic acid solution was cast on a glass substrate, and the glass substrate with the polyamic acid film was placed in an oven at 75°C, 230°C, and 400°C for 1.0h, 1.0h, and 1.5h, respectively.

[0074] The performance of the polyimide film was tested, a...

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Abstract

The invention discloses a polyimide film and a preparation method and application thereof, the thickness of the polyimide film is 15 micrometers or above, and the polyimide film is prepared through the following steps that 1, anhydride monomers and diamine monomers are polymerized through a condensation reaction to generate polyamide acid, the anhydride monomers comprise BPDA and PMDA, and the diamine monomers comprise pPDA; according to the molar weight of the anhydride monomer, the PMDA accounts for 10-45%; 2) coating the solution of the polyamide acid on a substrate; and 3) carrying out heating imidization on the mixture according to the following method which comprises the following three heating sections: (i) heating for 0.5-1.5 hours at the temperature of 30-100 DEG C; (ii) heating at the temperature of 190 to 250 DEG C for 0.5 to 1.5 hours; and (iii) heating at 350 to 450 DEG C for 0.5 to 1.5 hours.

Description

technical field [0001] The present invention relates to a heat-resistant polyimide film which can be used for preparing flexible display substrates, and the film has improved adhesiveness, thermal expansion coefficient and light transmission properties. The present invention also relates to a method for producing the heat-resistant polyimide film and its use as a flexible display substrate. Background technique [0002] For flexible display devices that are increasingly in demand, compared with glass materials with large specific gravity and not easy to bend, polymer materials are easy to make ultra-thin films due to their small specific gravity, good flexibility, and good surface flatness. A prime candidate for replacement glass. In the low temperature polysilicon (LTPS) process used in the fabrication of OLED displays, the process temperature may reach above 450°C, or even exceed 500°C. This requires that the flexible polymer film substrate material must be able to withs...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G73/10C08J5/18C08L79/08G09F9/30
CPCC08G73/1067C08G73/1042C08J5/18G09F9/301C08J2379/08
Inventor 杜丽君胡方振袁利兵张帅林
Owner SHANGHAI 3F NEW MATERIAL TECH CO LTD
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