UV-cured heat-conducting silica gel composition

A heat-conducting silica gel and composition technology, applied in the direction of adhesives, heat exchange materials, adhesive additives, etc., can solve the problems of incomplete curing, etc., and achieve the effect of being conducive to construction, good adhesion, and good compatibility

Active Publication Date: 2022-07-22
XIAMEN WELDTONE TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The purpose of the present invention is to overcome the defects of the prior art and provide a UV curing thermally conductive silica gel composition. On the one hand, the compatibility between the thermally conductive filler and the silica gel is improved, so that the thermally conductive filler has good dispersibility in the silica gel. The same amount of thermally conductive filler It can not only achieve better thermal conductivity, but also slow down the sharp increase in the viscosity of silica gel, or reduce the amount of thermally conductive fillers to achieve the same thermal conductivity and slow down the sharp increase in the viscosity of silica gel; on the other hand, UV and moisture Dual curing can solve the problem of incomplete curing caused by the inability to irradiate the shadow part in UV curing

Method used

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  • UV-cured heat-conducting silica gel composition

Examples

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Embodiment 1～3

[0050] Examples 1-3 Preparation of Modified Polysiloxane

Embodiment 1

[0052] Polysiloxane ViSiMe 2 (OSiMe 2 )a (OSiMeR 2 ) b (OSiMeR 3 ) c OSiMe 2 Vi, Me, Vi as above, R 2 is 3-methacryloyloxypropyl, R 3 is phenyl, a:b:c=0.88:0.07:0.05, and the polysiloxane viscosity (25°C) is 2750 mPa.s. Polysiloxane can be composed of octamethylcyclotetrasiloxane, 3-methacryloyloxypropylmethyldimethoxysilane and tetramethyltetraphenyl, with tetramethylammonium hydroxide as a catalyst, Tetramethyldivinyldisiloxane is used as end-capping agent, and it is obtained by reaction at 110-120°C.

[0053] The above-mentioned polysiloxane and trimethoxyhydrosilane are put into the reaction vessel at a ratio of 1:2 of the molar number of vinyl in the polysiloxane and the mole number of silicon-hydrogen bonds in the trimethoxyhydrosilane, and the reaction system weight is 0.1wt. % hydroquinone, be warming up to 90 ℃ and add Karstedt catalyst (in terms of Pt, add-on is 20ppm of the weight of the reaction system), maintain the reaction temperature at 110-120 ℃ and r...

Embodiment 2

[0055] Polysiloxane ViSiMe 2 (OSiMe 2 ) a (OSiMeR 2 ) b OSiMe 2 Vi, Me, Vi as above, R 2 It is 3-methacryloyloxypropyl group, a:b=0.95:0.05, and the polysiloxane viscosity (25°C) is 3840 mPa.s.

[0056] The above-mentioned polysiloxane and trimethoxyhydrosilane are put into the reaction vessel at a ratio of 1:1.8 of the number of moles of vinyl in the polysiloxane and the number of moles of silicon-hydrogen bonds in the trimethoxyhydrosilane, and 0.1wt of the reaction system weight is added. % hydroquinone, be warming up to 90 ℃ and add Karstedt catalyst (by Pt, the addition is 20ppm of the weight of the reaction system), maintain the reaction temperature at 110-120 ℃ and react for 3.5 hours, remove the excess trimethoxyl group under reduced pressure Hydrosilane, to obtain a modified polysiloxane, the viscosity at 25°C is 4270 mPa.s.

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Abstract

The invention relates to the technical field of heat-conducting electronic adhesives, and provides a UV-cured heat-conducting silica gel composition which comprises the following raw material components in parts by weight: 100 parts of modified polysiloxane, 1-1000 parts of a modified heat-conducting filler, 1-5 parts of a photoinitiator and 5-20 parts of a curing aid, the structural general formula of the modified polysiloxane is (R1O) 3-nSiMenCH2CH2SiMe2 (OSiMe2) a (OSiMeR2) b (OSiMeR3) cOSiMe2CH2CH2MenSi (R1O) 3-n, and the structural general formula of the curing aid is ViSiMe2 (OSiMe2) x (OSiMeR6) yOSiMe2Vi. The UV-cured heat-conducting silica gel composition disclosed by the invention is good in mechanical property, good in heat conductivity and high in adhesion strength after being cured.

Description

technical field [0001] The invention belongs to the technical field of thermally conductive electronic adhesives, and relates to a UV-cured thermally conductive silica gel composition. Background technique [0002] Thermal silica gel is an important raw material in electronic products, which can export the generated heat to the environment as soon as possible, improving the service life and accuracy of electronic products. Thermally conductive silicone improves thermal conductivity by filling a larger amount of thermally conductive fillers. The more thermally conductive fillers are filled, the finer the particle size of the thermally conductive fillers, the higher the thermal conductivity in general, but at the same time it will also bring about a sharp increase in the viscosity of the silicone composition. , affecting the use of thermally conductive silicone. Therefore, improving the compatibility of the thermal conductive filler with the silica gel by surface treatment of...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J183/07C09J11/04C09J11/06C09K5/14
CPCC09J183/06C09J11/04C09J11/06C09K5/14C08K2003/2227C08K2201/014C08K9/08C08K7/18C08K3/22C08K5/5425C08K3/34
Inventor 张秀琴刘涛曹阳
Owner XIAMEN WELDTONE TECH CO LTD
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