The invention belongs to the technical field of high molecular material, and especially relates to a high-temperature-resistant high-molecular conductive
composite material. The high-temperature-resistant high-molecular conductive
composite material is composed of, by weight, 40 to 55 parts of a high-molecular
polymer base material, 15 to 20 parts of a conductive filler, 5 to 8 parts of an
inorganic filler, 1 to 2 parts of a
flame retardant, and 0.5 to 0.8 part of a dispersant. The method comprises the following steps: the high-molecular
polymer base material, the conductive filler, the
inorganic filler, the
flame retardant and the dispersant are weighed at the formula ratio, and are mixed to be uniform so as to obtain a premixed
raw material;
melt blending and extruding are carried out soas to obtain the high-temperature-resistant high-molecular conductive
composite material. According to a preparation method, the high-molecular
polymer base material and the conductive filler are taken as main raw materials, and the
flame retardant and the dispersant are added to provide the high-temperature-resistant high-molecular conductive composite material with high
temperature resistance characteristic, and the compatibility degree of the various raw materials is increased; the adopted materials are nanometer grade particles, so that the
conductivity is increased to a high degree, it is convenient for using, and the service life of the high-temperature-resistant high-molecular conductive composite material is prolonged.