Temporary adhesive for wafer processing, wafer laminate, and method for manufacturing thin wafer

A temporary bonding and wafer processing technology, which is applied in semiconductor/solid-state device manufacturing, adhesives, adhesive additives, etc., can solve the problems of cleaning and removal, difficult to apply manufacturing technology, and long time, etc., to achieve cleaning and removal Excellent performance, excellent durability, high heat resistance effect

Pending Publication Date: 2022-08-05
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, it takes a very long time to peel off, and it is difficult to apply it to the actual manufacturing process.
In addition, it takes a long time to clean the silicone pressure-sensitive adhesive that remains as a residue on the substrate after peeling, so there is also a problem in terms of cleaning removability.

Method used

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  • Temporary adhesive for wafer processing, wafer laminate, and method for manufacturing thin wafer
  • Temporary adhesive for wafer processing, wafer laminate, and method for manufacturing thin wafer
  • Temporary adhesive for wafer processing, wafer laminate, and method for manufacturing thin wafer

Examples

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Embodiment

[0127] Hereinafter, preparation examples, comparative preparation examples, examples, and comparative examples are shown to describe the present invention more specifically, but the present invention is not limited to these examples. In addition, the viscosity is the measured value at 25 degreeC using a rotational viscometer.

[0128] [1] Preparation of thermosetting silicone resin solution

preparation example 1

[0130] To a solution composed of 100 parts by mass of dimethylpolysiloxane having 2.5 mol % of vinyl groups in molecular side chains, 30,000 Mn, and 200 parts by mass of toluene, add: 50 parts by mass of 50 mol % of SiO 4 / 2 unit (Q unit), 48 mol% of (CH 3 ) 3 SiO 1 / 2 units (M units) and 2 mol% of (CH 2 =CH) 3 SiO 1 / 2 Units (Vi units), a solution composed of vinylmethylpolysiloxane with Mn of 7000 and 100 parts by mass of toluene, 230 parts by mass of organic hydrogen represented by the following formula (M-1) with Mn of 2800 Polysiloxane, a linear dimethylpolysiloxane having a viscosity (25° C.) of 30,000 mPa·s from 50 parts by mass of a 30 mass % toluene solution and having both ends of the molecular chain blocked by trimethylsiloxy groups A solution consisting of 120 parts by mass of toluene and 0.6 part by mass of 1-ethynylcyclohexanol were mixed. Furthermore, 0.4 parts by mass of a hydrosilylation reaction catalyst CAT-PL-5 (manufactured by Shin-Etsu Chemical Co., L...

preparation example 2

[0134] 70 parts by mass of dimethylpolysiloxane having 2.5 mol % of vinyl groups in molecular side chains and Mn of 30,000, and 30 parts by mass of dimethyl polysiloxane having 0.15 mol % of vinyl groups in both terminal chains and Mn of 60,000 To a solution consisting of dimethylpolysiloxane and 200 parts by mass of toluene, add: 50 parts by mass of SiO containing 50 mol % 4 / 2 unit (Q unit), 48 mol% of (CH 3 ) 3 SiO 1 / 2 units (M units) and 2 mol% of (CH 2 =CH) 3 SiO 1 / 2 Unit (Vi unit), a solution composed of vinylmethylpolysiloxane having Mn of 7000 and 100 parts by mass of toluene, 180 parts by mass of organohydrogenpolysilicon having Mn of 2800 represented by formula (M-1) Oxane, 30 parts by mass of a 30 mass % toluene solution having a viscosity (25° C.) of 1000 mPa·s, linear dimethylpolysiloxane having both ends of the molecular chain blocked by trimethylsiloxy groups, and 0.6 parts by mass of 1-ethynylcyclohexanol, and then mixed. Further, 0.4 parts by mass of a h...

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Abstract

The invention provides a temporary adhesive for wafer processing, a wafer laminate and a method for manufacturing a thin wafer, wherein the temporary adhesive comprises a thermosetting silicone resin composition containing a non-functional organopolysiloxane and is used for temporarily bonding a wafer and a support body.

Description

technical field [0001] The present invention relates to a temporary adhesive for wafer processing, a wafer laminate, and a method for producing a thin wafer. Background technique [0002] In order to achieve higher density and larger capacity, three-dimensional semiconductor packaging is becoming essential. The so-called three-dimensional packaging technology is a semiconductor manufacturing technology in which a single semiconductor chip is thinned, and the semiconductor chip is laminated into multiple layers while conducting through silicon vias (TSV: through silicon via). In order to realize this technique, a process of reducing the thickness of the substrate on which the semiconductor circuit is formed by grinding the non-circuit forming surface (also referred to as the back surface), and further forming electrodes including TSVs on the back surface. Conventionally, in the backside grinding step of a silicon substrate, a backside protective tape is attached to the side ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/304C09J11/04C09J11/06C08L83/05C08L83/07C09J183/04C09J183/05C09J183/07
CPCC09J183/04H01L21/6835H01L2221/68327H01L2221/68386C09J7/38C09J11/04C09J11/06C08G77/20C08G77/12C08L83/04H01L21/304C09J2301/312C09J2203/326C09J2203/37C09J2301/502H01L21/30625H01L21/6836
Inventor 武藤光夫田上昭平菅生道博
Owner SHIN ETSU CHEM IND CO LTD
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