Rapid cooling diffusion furnace and waste gas treatment method thereof

Abstract

The rapid cooling diffusion furnace comprises a furnace body, sliding covers, first insertion pipes and second insertion pipes, the sliding covers are slidably installed on the two opposite sides of the furnace body, the multiple first insertion pipes penetrating through the furnace body are installed on the inner side of one sliding cover, and the multiple second insertion pipes penetrating through the furnace body are installed on the inner side of the other sliding cover; cooling water enters the first insertion pipe through the connecting water pipe and the inner channel and then is discharged from the connecting water pipe through the second insertion pipe and the inner channel, at the moment, the contact area between the first insertion pipe and the second insertion pipe and gas in the furnace body is increased through the heat exchange grid, and then heat in the furnace body is transferred through the circulating cooling water; and a plurality of groups of radiating pipes are constructed in the furnace body for cooling water rotation while internal hot gas is exhausted, so that the cooling efficiency is greatly improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor processing, in particular to a rapid cooling diffusion furnace and a waste gas treatment method thereof. Background technique [0002] Diffusion furnace is one of the important process equipment in the pre-process of semiconductor production line. It is used for diffusion, oxidation, annealing, alloying and sintering in industries such as large-scale integrated circuits, discrete devices, power electronics, optoelectronic devices and optical fibers. [0003] During the processing of the diffusion furnace, it is sometimes necessary to rapidly cool the internal temperature. The existing cooling method is achieved by air cooling or cooling water circulating in the water pipe wrapped outside the furnace body. The two cooling methods have slow cooling efficiency and affect semiconductors. processing. SUMMARY OF THE INVENTION [0004] The problem solved by the present invention is to provide a ...

AI Technical Summary

Problems solved by technology

[0004] The problem to be solved by the present invention is to provide a rapid cooling diffusion furnace and its exhaust gas treatment method, which solves the problem that sometimes the internal temperature of the diffusion furnace needs to be rapidly lowered during processing. The existing cooling method is through air cooling or wrapping outside the furnace body The cooling water circulating in the water pipe realizes cooling. There are two cooling methods, and the cooling efficiency is slow, which affects the technical problems of semiconductor processing.

Images