Unlock instant, AI-driven research and patent intelligence for your innovation.

Epoxy-resin composition and use thereof

An epoxy resin, epoxy compound technology, applied in plastic/resin/wax insulators, organic insulators, transportation and packaging, etc., can solve problems such as corrosion or leakage of metal parts, insufficient research on improvement accelerators, and deterioration of mechanical properties.

Inactive Publication Date: 2004-07-07
MITSUI CHEM INC
View PDF2 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] (2) During the curing process, homopolymerization of epoxy monomers occurs locally due to side reactions, which generate excessive hydroxyl groups in the resulting phenolic resin, thereby deteriorating moisture resistance and electrical properties, and Deterioration of mechanical properties due to epoxy homopolymerization and excess phenolic fractions in addition to the desired epoxy-phenolic network; and
[0007] (3) Doping with free ions, especially halide ions, can cause corrosion or leakage of metal parts in semiconductors
[0013] To solve this problem, various epoxy resins and phenolic resins have been developed, but research on improving accelerators is still insufficient

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Epoxy-resin composition and use thereof
  • Epoxy-resin composition and use thereof
  • Epoxy-resin composition and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0094] Bisphenol-A type diglycidyl ether (trade name: Epicoat 828, Yuka Shell Epoxy, epoxy group equivalent: 184g / equivalent) and novolac resin ( Trade name: BRG #558, Showa Kobunshi, hydroxyl equivalent: 104 g / equivalent) was melted and then kneaded at 80°C to obtain a uniform resin mixture.

[0095] Add 0.005 mol of phosphine oxide represented by general formula (1) to this resin composition, wherein R 1 -R 6 Both were methyl groups (hereinafter referred to as "PZO"), and the mixture was kneaded at 50°C for 1 minute.

[0096] 200 g of the resin component was mixed with fillers and other additives in the following proportions, and the mixture was heated and kneaded with rollers to obtain a molding compound for sealing parts:

[0097] Inorganic filler: 720g

[0098] [50 parts by weight of spherical fused silica (Halimic S-CO, Micron) and 50 parts by weight of amorphous fused silica (Fusedrex RD-8, Tatsunori)]

[0099] Silane coupling agent: 62g

[0100] (SZ-6083, Toray Do...

Embodiment 2

[0114] The molding compound of the sealing member is obtained as described in Example 1, but with tetraphenol ethane type epoxy resin (trade name: E1031S, Yuka Shell Epoxy, epoxy group equivalent: 189g / equivalent) as epoxy resin.

[0115] The material was processed as described in Example 1 to determine the physical properties of the cured product and to conduct crack tests on experimental semiconductor devices. The results are shown in Table 1.

[0116]

Embodiment 3

[0118]A molding compound for the seal was prepared as described in Example 1, except that a naphthol-cresol novolac condensate type epoxy resin represented by the formula (13) (trade name: EOCN7000, Nihon Kayaku, Cyclic Oxygen equivalent: 204g / equivalent) as epoxy resin.

[0119] This material was treated as described in Example 1 to determine the physical properties of the cured product, and the semiconductor device tested was subjected to a crack test. The results are shown in Table 1.

[0120]

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Hydroxyl equivalentaaaaaaaaaa
Hydroxyl equivalentaaaaaaaaaa
Epoxy equivalentaaaaaaaaaa
Login to View More

Abstract

An epoxy-resin composition comprising (A) an at least bifunctional epoxy compound and / or an at least bifunctional epoxy resin, (B) a curing agent, and (C) an accelerating agent, the accelerating agent essentially containing a phosphine oxide represented by general formula (1);where R1 to R6 all of which may be the same or not are hydrogen, straight, branched or cyclic alkyl having 1 to 10 carbons or aryl or aralkyl having 6 to 10 carbons.

Description

technical field [0001] The present invention relates to an epoxy resin composition, in particular to an epoxy resin composition having properties suitable for sealing semiconductor integrated circuits, and also to cured products thereof and semiconductor devices in which semiconductor integrated circuits are sealed with the epoxy resin . Background technique [0002] Integrated circuits (IC) or large scale integrated circuits (LSI) are especially protected by seals to eliminate malfunctions due to dirt or dust, heat, moisture or light in the external atmosphere. In recent years, this kind of seal has been changed from metal or ceramic to resin, and the current seal is mainly completed with epoxy resin. In particular, considering the balance between cost and physical properties, epoxy resin compositions containing phenolic resins as curing agents are often used; especially novolac type epoxy resin compositions containing phenolic resins as curin...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C08G59/68H01B3/40
CPCH01B3/40C08G59/688Y10T428/12528C08L63/00
Inventor 浦上达宣升忠仁杉本贤一高木夘三治诧摩启辅
Owner MITSUI CHEM INC
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2025 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com