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A technology of electroplating solution and divalent copper ions, which is applied in the field of copper electroplating on a substrate, a special complexing agent, and can solve the occasional instability of the plating solution and other problems
Inactive Publication Date: 2004-10-13
LEARONAL
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Although this method has achieved some industrial success, it has been reported that the plating solution is occasionally unstable.
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Embodiment 1
[0038] The following compounds were dissolved in deionized water to prepare a monovalent copper electroplating solution.
[0039] 5,5-Dimethylhydantoin 90g / l
[0040] Cuprous chloride 15g / l
[0041] Sodium bisulfite 30g / l
[0042] Triethylenetetramine 0.05ml / l
[0043] Adjust the pH of the plating solution to 8.5 with sodium hydroxide. Maintain the temperature of the plating solution at 110-125°F (43-52°C), and use the motor to drive the stirrer to stir the plating solution.
[0044] In the resulting bath, with 5 and 10A / ft 2 (0.54 and 1.08A / dm 2 ) Cathode current density Electroplating the brass test piece and steel test piece until the thickness is 0.3 mil (7.5 μm). The current density is 0.54A / dm 2 (5A / ft 2 ), the plating time is 48 minutes, and the current density is 1.08A / dm 2 (1.0A / ft 2 ), the plating time is 24 minutes. The deposited copper combines well with the base metal and has a bright appearance.
Embodiment 2
[0046] Except for 27 g / l of copper chloride as the source of copper ions, the rest were all prepared as described in Example 1 to prepare a monovalent copper electroplating solution. As described in Example 1, the brass test piece and the steel test piece were electroplated. The appearance and bonding force of the plated copper layer are basically the same as in Example 1.
Embodiment 3
[0048] Except that 15 g / l cuprous oxide was used as the source of copper ions, the others were all as described in Example 1 to prepare a monovalent copper electroplating solution. As described in Example 1, the brass test piece and the steel test piece were electroplated. The appearance and bonding force of the plated copper layer are basically the same as in Example 1.
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Abstract
A substantially cyanide-free plating solution for depositing copper from the monovalent ionic state, which includes a source of copper ions, a reducing agent capable of reducing divalent copper ions to monovalent copper ions, an alkali material in an amount sufficient to maintain the pH of the solution in the range of about 7 to about 10, and a complexing agent of an imide, such as succinimide, 3-methyl-3-ethyl succinimide, 3-methyl succinimide, 3-ethyl succinimide, 3,3,4,4-tetramethyl succinimide, or 3,3,4-trimethyl succinimide, or a hydantoin, such as dimethyl hydantoin. The substantially cyanide-free plating solutions may also include at least one of a conductivity salt, an additive to promote brightness, or an alloying metal. The reducing agent may be an alkali sulfite, alkali bisulfite, hydroxylamine, or hydrazine. The copper is typically provided in the form of CuC1, CuC12, CuSO4, or Cu20 in an amount sufficient to provide a copper ion concentration of from about 2 to about 30 grams per liter of solution, and the complexing agent is present in an amount sufficient to provide a molar ratio of copper ions to complexing agent of from about 1:1 to about 1:5, preferably about 1:4. The alkali material is typically NaOH, KOH, NH4OH, or Na2CO3, and the conductivity salt is typically NaC1, KC1, Na2SO4, K4P2O7, Na3PO4, C6H5Na3O7, C6H11NaO7, NH4C1, or KNaC4H4O6. Useful additives include organic amines or oxyalkyl polyamines, such as triethylene tetramine, tetraethylene pentamine, and polyoxypropyl-triamine. Methods for preparing such a solution for plating copper onto a substrate, and of plating copper onto a substrate with such a solution are also disclosed.
Description
[0001] The invention relates to a monovalent copper non-cyanide electroplating solution for electroplating copper on a substrate. Background technique [0002] Various electroplating solutions using cyanide as a complexing agent have been successfully used for copper plating for many years. In this type of bath, copper exists in the form of a complex of monovalent copper and cyanide. This type of plating solution may also contain free or uncomplexed alkali metal cyanide, alkali metal hydroxide, and complexing agents such as alkali metal tartrate to facilitate the dissolution of the copper anode. Although this type of plating solution has been successfully used, the industry has been unswervingly seeking substitutes for highly toxic cyanide ions. [0003] The electroplating solution used to deposit monovalent copper is quite different from the electroplating solution used to deposit monovalent silver. Under normal circumstances, monovalent silver is very stabl...
Claims
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