Electronic package for electronic element and manufacturing method thereof

Abstract

A method of making an electronic package. The method includes forming a semiconductor chip and an multi-layered interconnect structure. The semiconductor chip includes a plurality of contact members on one of its surfaces that are connected to the multi-layered interconnect structure by a plurality of solder connections. The formed multi-layered interconnect structure is adapted for electrically interconnecting the semiconductor chip to a circuitized substrate (eg., circuit board) with another plurality of solder connections and includes a thermally conductive layer being comprised of a material having a selected thickness and coefficient of thermal expansion to substantially prevent failure of the solder connections between said first plurality of electrically conductive members and the semiconductor chip. The method forms the electronic package to further include a dielectric material having an effective modulus to assure sufficient compliancy of the multi-layered interconnect structure during operation.

Description

technical field [0001] This invention relates generally to electronic packages for mounting integrated circuits, and more particularly to organic multilayer interconnect structures for use in such packages. Background technique [0002] Organic substrates, such as printed circuit boards and chip carriers, have been and are being developed for many applications. Especially in many chip carrier applications, they are promising replacements for ceramic substrates due to cost reduction and enhanced electrical performance. The use of multilayer interconnect structures such as organic chip carriers to interconnect semiconductor chips to printed circuit boards in electronic packaging introduces many challenges, one of which is the reliability of the connection point between the semiconductor chip and the organic chip carrier, Another is the reliability of the connection point between the organic chip carrier and the printed circuit board. [0003] Since the increase in the number...

AI Technical Summary

Problems solved by technology

These limitations can limit the superior electrical performance of organic electronic packaging, or significantly increase the cost of electronic packaging

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