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Method for utilizing sulfuric acid/peroxide liquid mixture

A technology of peroxide and mixed liquid, which is applied in the direction of chemical instruments and methods, water/sewage treatment, water/sludge/sewage treatment, etc., can solve the problems of no re-use, etc., to reduce the amount of waste, protect the environment, reduce The effect of emissions

Inactive Publication Date: 2005-03-09
SONY CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0010] Hitherto, it has been considered that there is no possibility of re-use other than discharging the spent sulfuric acid and peroxide mixture as wastewater effluent

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] 5 liters of waste liquid (a) was injected into the reactor equipped with a stirrer and cooling device, and cooled to water temperature. Under stirring, 5 drops of fuming nitric acid waste liquid are added dropwise in the waste liquid, and the weight of each drop is about 0.2 grams. This fuming nitric acid waste liquid is used as a resist stripping liquid in the metal interconnection step in the semiconductor processing process. From where the nitric acid was added dropwise, foam due to the decomposition of the peroxide appeared and disappeared again within about 2 minutes. Analyze the remaining amount of hydrogen peroxide aqueous solution in the waste liquid before and after the decomposition reaction. It was found that after decomposition, the remaining amount of about 1 wt% was reduced to 10 ppm or less. The concentration of sulfuric acid in the decomposed solution obtained by the decomposition was 82% by weight. The sulfuric acid obtained after purification can be ...

Embodiment 2

[0041] At a temperature of 110°C, add 7 drops of 10wt% sulfuric acid dropwise to 20 liters of waste liquid (b) installed in the semiconductor chip cleaning tank, and the weight of each drop is about 0.3 grams. The filter, similar to the case of Example 1, from the point where the nitric acid was dropped, showed foam due to the decomposition of the peroxide. The foam disappeared within about 1 minute. Before and after the decomposition reaction, a resist solution was added dropwise to the waste liquid. As for the solution before decomposition, after injecting the resist solution, the whole solution turned light yellow, and within about 3 minutes, the solution became transparent again as before. The decomposed solution will remain light yellow. The reason for this is that the decomposition of peroxide in the waste liquid has been completed. The concentration of sulfuric acid in the decomposition liquid obtained by the decomposition was 90 wt%. Like Example 1, the purified su...

Embodiment 3

[0043] In the decomposed solution (concentration of sulfuric acid is 82wt%) obtained in 5 gram embodiment 1, add 0.2 gram waste (ABS resin) of 8mm cassette tape protective plate gray part, then react at 80 ℃ temperature for 60 minute. After the reaction, the solid product was recovered and washed with water until the acid was gone. The resulting gel product was dried at 80°C for 2 hours. The hygroscopicity of the obtained black solid substance to pure water and simulated urine was about 100 times and about 50 times its own weight, respectively.

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PUM

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Abstract

The present invention develops a technique of utilizing a sulfuric acid / peroxide liquid mixture, for example, its waste liquid material, so that the waste liquid can be re-utilized and effectively applied to obviate the problem resulting from disposal. To this end, the present invention provides a method for utilizing a sulfuric acid / peroxide liquid mixture, for example, its waste liquid, in which peroxide in the sulfuric acid / peroxide liquid mixture is decomposed to render it possible to utilize the liquid mixture as sulfuric acid.

Description

technical field [0001] The present invention relates to a kind of method utilizing sulfuric acid and peroxide mixture. More particularly, the present invention relates to a process utilizing a sulfuric acid and peroxide mixture which has the advantage of reusing the spent sulfuric acid and peroxide mixture. Background technique [0002] So far, in most semiconductor processing processes, a large amount of sulfuric acid and peroxide mixtures are still used as semiconductor chip rinse solutions, either in the form of sulfuric acid / hydrogen peroxide aqueous solution or in the form of sulfuric acid / ozone mixed solution. [0003] This sulfuric acid and peroxide mixed solution is a typical rinsing solution mainly used to peel off the photosensitive resist on the semiconductor wafer or remove metal particles, especially heavy metal particles. The amount of this mixed solution is much larger than that of other flushing solutions, such as ammonia / hydrogen peroxide solution, hydrochl...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C02F1/58
Inventor 稻垣靖史
Owner SONY CORP