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Polishing platen with pressurized membrane

A fixed table and diaphragm technology, used in grinding machine tools, abrasive belt grinders, grinding tools, etc., can solve problems such as affecting air bearing pressure and increasing complexity of CMP processing, reducing air volume and improving performance.

Inactive Publication Date: 2005-07-06
APPLIED MATERIALS INC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, if the cushion 18 is pushed against the wafer holder 22 in one area, it affects the pressure in all areas of the air bearing, adding unnecessary complexity to the CMP process

Method used

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  • Polishing platen with pressurized membrane
  • Polishing platen with pressurized membrane
  • Polishing platen with pressurized membrane

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Embodiment Construction

[0027] The present invention discloses the use of multiple pressurized diaphragms and piezoelectric elements to replace a wafer holder air bearing to improve performance in CMP processing. In one embodiment, a pressurized diaphragm is provided that provides zonal control during CMP processing via concentric balloons. In a further embodiment, piezoelectric elements are positioned above the wafer holder, which provides zone control during CMP processing. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the invention. It will be apparent, however, to one skilled in the art, that the present invention may be practiced without some or all of these specific details. In other instances, well known process steps have not been described in detail in order not to unnecessarily obscure the present invention.

[0028] Figures 1-2 have been described from the point of view of the prior art. image 3 To illustrate a wafe...

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Abstract

The present invention is used for performance improvement in CMP processes using a pressurized diaphragm and a plurality of piezoelectric elements to replace wafer holder air bearings. In one embodiment, a wafer holding station for improving performance in chemical mechanical polishing applications is disclosed. The wafer fixing table includes a diaphragm arranged above the wafer fixing table and a plurality of annular airbags arranged below the diaphragm, wherein the annular airbags can exert force on the diaphragm. In this way, zone control can be provided during CMP processing. In a further embodiment, a plurality of piezoelectric elements are disposed above the wafer holding table, which apply force to the abrasive tape during CMP processing, resulting in improved zone control during CMP processing.

Description

technical field [0001] The present invention relates generally to chemical mechanical polishing apparatus, and more particularly to wafer holder designs using pressurized diaphragms and piezoelectric elements to improve performance in chemical mechanical polishing applications. Background technique [0002] In the manufacture of semiconductor devices, chemical mechanical polishing (CMP) operations including grinding, polishing and wafer cleaning are required. Generally, integrated circuit devices exist in the form of multi-layer structures. A transistor device having a diffusion region is formed in the substrate layer. In subsequent layers, a plurality of interconnecting metal lines are patterned and electrically connected to the transistor devices to define the desired functional devices. Patterned conductive layers are insulated from other conductive layers by a dielectric material such as silicon dioxide. As more metal layers and associated dielectric layers are formed...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B24B37/04B24B21/04B24B37/12B24B49/16B24D9/08
CPCB24B21/04B24B37/12B24B49/16B24D9/08
Inventor 罗德·基斯特勒约翰·博伊德阿列克·奥夫恰兹
Owner APPLIED MATERIALS INC