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Cross-linked low medium electrical property high polymer material and film, base plate and electronic part using the same

A polymer material, low dielectric technology, applied in the direction of circuit substrate materials, printed circuit components, electrical components, etc., can solve the problem of high dielectric constant, unsatisfactory properties, and polyimide resin not practical Level and other issues, to achieve the effect of improving mechanical properties, dielectric constant and dielectric loss tangent, and good adhesion

Inactive Publication Date: 2006-01-04
TDK CORPARATION +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] These materials with pattern forming ability have relatively good heat resistance, but related to epoxy resin and unsaturated polyester resin, the dielectric constant is relatively high, above 3, and satisfactory characteristics cannot be obtained.
And the photosensitive polyimide resin has not reached the practical level

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0053] Add 85 parts by weight of dicyclohexyl fumarate (di-CHF) and 15 parts by weight of glycidyl acrylate (GAA) to a glass ampoule, then add 1 part by weight of azobisisobutyronitrile (AIBN) as free radical polymerization initiator, and then add 10 parts by weight of refined benzene into the glass ampoule, fully carry out nitrogen replacement, repeatedly perform decompression and degassing, and seal the ampoule under vacuum. Then, this ampoule was placed in a thermostat at 40° C., and kept for 72 hours. After the polymerization is completed, the content liquid is added to a large amount of methanol, the polymer is precipitated and separated, and dried under reduced pressure to obtain the target copolymer.

Synthetic example 2

[0055] Except that glycidyl methacrylate (GMA) was used instead of GAA in Synthesis Example 1, the other was the same to prepare a copolymer.

Synthetic example 3

[0057] A copolymer was obtained in the same manner as in Synthesis Example 1 except that 3,4-epoxycyclohexylmethanol acrylate (ECHMA) (manufactured by Daicel Chemical Industry Co., Ltd., trade name: CYCLOMER A 200) was used instead of GAA.

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PUM

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Abstract

Disclosed is a polymer material of low relative permittivity obtained through copolymerization of a monomer composition that contains, as monomers, a fumaric diester and an epoxy group-having (meth)acrylate. The polymer material bonds or adheres well to metal conductor layers, and, after crosslinked, it is patternable. In addition, it has good electric properties of low relative permittivity, low dielectric loss tangent and good electric insulation, and has good heat resistance.

Description

technical field [0001] The present invention relates to a novel low-dielectric high-molecular material with pattern forming ability, and a thin film, a substrate, and an electronic component using the same. More specifically, it relates to electrical characteristics in the high-frequency band, low dielectric constant, low dielectric loss tangent performance, heat resistance even in the high-temperature range, and good adhesion and adhesion to metal foil , and low-dielectric polymer materials with thin film patterning ability. Background technique [0002] In recent years, with the rapid increase in the amount of communication information, there is a strong demand for miniaturization, weight reduction, and high-speed communication equipment, and low-dielectric polymer materials that adapt to this development are required. In particular, high-frequency bands of radio waves used in portable mobile communications such as automobile phones and digital mobile phones, and satellit...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08F220/10C08F222/10C08J5/18C08F220/32C08F222/14H01B3/44H01L23/14H05K1/03
CPCC08F220/32C08F222/14H01B3/448C08F220/325C08F222/10
Inventor 浅见茂山田俊昭菅原辉明堀田宽史
Owner TDK CORPARATION