Ball grid array semiconductor package

Abstract

The ball grid array semiconductor package is manufactured through forming discontinuous fractures in the set parts of conducting trace on the substrate to expose the soldering inhibitor in the fractures and adjacent trace parts and to form discontinuous soldering pads; and selectively implanting soldering balls onto the discontinuous soldering pads to make the conducting trace with soldering balls form conducting path. The soldering balls are jointed to the soldering pads in unstable state and may be removed easily to make the conducting trace broken; and the removed soldering balls may be re-implanted to the soldering pads to restore the electric conductivity of the conducting trace.

Description

technical field [0001] The present invention relates to a semiconductor package, in particular to a ball grid array (BallGrid Array, BGA) semiconductor package, using a plurality of solder balls (Solder Ball) as input / output (Input / Output, I / O) The terminal enables the chip in the semiconductor package to be electrically connected to the outside world. Background technique [0002] The semiconductor package is characterized in that at least one semiconductor chip is loaded on a chip carrier (such as a substrate, a lead frame, etc.), and the chip is connected by a bonding wire (Bonding Wire) or a solder bump (that is, a flip-chip structure, Flip Chip) and other conductive components are electrically connected to the chip carrier, and then resin materials such as epoxy resin (Epoxy Resin) are used to form an encapsulant that covers the chip and conductive components, so that the chip is airtightly isolated from the outside world ; The packaged chip can be integrated with an e...

AI Technical Summary

Problems solved by technology

[0006] However, the above-mentioned method of using laser technology still has many disadvantages; one is that the method must prepare a laser generator to generate corresponding laser light to complete, and the manufacturing cost of this laser generator is high, so it will greatly increase the production of packaged products cost

In addition, cutting conductive traces with a laser will cause pollution, and additional cleaning procedures are required for the package, which further increases the cost; and the energy of the laser needs to be controlled accurately, because the internal structure of the semiconductor package is very fine. A slight error in the laser energy for cutting the conductive traces will cause damage to other parts of the semiconductor package (such as the lower conductive traces) and affect the yield of finished products

In view of this, the way to solve the above problems is to let no other conductive traces be laid under the conductive traces for burning and cutting, or to pre-lay a copper layer under the conductive traces for burning and cutting, so that the energy of the laser will not damage other conductive traces; however, this practice places significant constraints on circuit layout on the substrate, especially for products with high-density routing

In addition, the conductive traces after burning and cutting cannot be restored to the original electrical conduction state, that is, once the packaged product has been burnt and cut to form certain specific functions, the product cannot be changed to have other functions, so The changes that can be provided in response to market demand are still insufficient

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