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Electronic sealer with three-dimensional stack and assembling method thereof

An electronic package and three-dimensional stacking technology, which is applied in the direction of electrical components, electric solid devices, circuits, etc., can solve the problems of complex manufacturing process, unstable pass rate, and increased packaging cost

Inactive Publication Date: 2007-01-17
IND TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this manufacturing method includes many related manufacturing processes such as mask making, photolithography, sputtering, electroplating, etc., as well as the manufacturing process of back-end assembly and solder ball array ball planting. The manufacturing process is quite complicated and the factors that affect the manufacturing process Too much will cause the manufacturing process to be unstable, and the packaging cost will be relatively increased
In addition, the through holes made on the chip can also be used as the vertical conduction path of the chip, but in the manufacturing process, the through holes of the chip need to be aligned and filled with conductive materials. It is quite difficult to make the pass rate unstable and cause difficulties in mass production

Method used

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  • Electronic sealer with three-dimensional stack and assembling method thereof
  • Electronic sealer with three-dimensional stack and assembling method thereof
  • Electronic sealer with three-dimensional stack and assembling method thereof

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Embodiment Construction

[0015] In order to have a further understanding of the purpose of the present invention, structural features and functions thereof, the accompanying drawings are described in detail as follows:

[0016] Please refer to Figure 1A to Figure 1E , which is a schematic diagram of the production process of the first embodiment of the present invention. like Figure 1A As shown, first utilize stud bump (stud bump) method to make several stud-shaped conductive bumps 11 on the carrying surface of substrate 10; Figure 1B As shown, a chip 20 with several through holes 21 corresponding to the columnar conductive bumps 11 is provided; then, the chip 20 and the substrate 10 are assembled, as Figure 1C As shown, the columnar conductive bump 11 is aligned through the through hole 21 of each chip 20, and the tail end of the columnar conductive bump 11 exceeds the height of the chip 20; thus, the chip 20 and the substrate 10 are bonded to form the first layer. Electronic packages. In addi...

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Abstract

Combining with method of columnar solder ball and through hole in module, the assembling method joints modules in upper layer and lower layer and completes electrical connection. Columnar conducting lug formed on supporting body through method of columnar solder ball. Making columnar conducting lugs pass through holes in module to assemble modules on supporting body so as to complete 3D piled encapsulation for electronic parts. The invention lowers encapsulation cost and simplifies procedure of encapsulation, is applicable to IC and microelectronics manufacturing area.

Description

technical field [0001] The invention relates to an electronic package and its assembly method, in particular to a three-dimensional stacked electronic package and its assembly method. Background technique [0002] Electronic Packaging (Electronic Packaging) is also known as electronic packaging, and its purpose is to give integrated circuit components (IC) an organizational structure so that it can perform its intended functions. From the perspective of the manufacturing process of microelectronic products, electronic packaging belongs to the manufacturing technology of the back-end of the product, so packaging is often considered to be only one of the supporting roles of integrated circuit manufacturing technology. In fact, electronic packaging technology dominates the size and cost of electronic products, so the development of packaging technology is no less important than IC manufacturing technology and other microelectronics-related manufacturing technologies. [0003] ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L21/50H01L21/98H01L21/60H01L25/04H01L23/12H01L23/48
CPCH01L2224/16145
Inventor 陈守龙吕芳俊彭逸轩游善溥
Owner IND TECH RES INST