Copper alloy for connector use and producing method thereof
A copper alloy and connector technology, applied in the direction of metal/alloy conductors, etc., can solve the problems of no market, unsuitable connectors, and inability to achieve the mechanical properties and various characteristics of connector materials.
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Embodiment 1
[0057] Copper alloys Nos. 1 to 6 with the composition (wt%) shown in Table 1 were melted at a temperature 70°C higher than the liquidus temperature, and then cast in a size of 30×70×1000 (mm) using a vertical small continuous casting machine of cast blanks. Cooling method: the cooling rate in the temperature range from the liquidus line to 600° C. is significantly higher than 50° C. / min by using a casting mold for primary cooling and water shower for secondary cooling.
[0058] Thereafter, each slab was heated in a temperature range of 800° C. to 840° C., then hot-rolled to a thickness of 5 mm, and the hot-rolling workability was evaluated from cracks on the surface and edges. After pickling, the test material in which cracks were not observed under a 50-magnification optical microscope was rated as ○, and the test material in which cracks were observed was rated as ×. The end temperature of hot rolling and calendering should be 600°C, and the crystal grain size should be con...
Embodiment 2
[0078] Alloy No. 12 having a composition of Cu-25.1Zn-0.82Sn within the composition range of the present invention was continuously casted by changing primary and secondary cooling conditions and drawing speed conditions. Cooling rates were measured with co-cast thermocouples. The liquidus line of this alloy is about 950°C, and the average cooling rate is calculated from this temperature to 600°C.
[0079] Thereafter, it was heated to 840° C., and hot rolling was performed 9 times at a reduction rate of about 15% per rolling, and surface and edge cracks were observed.
[0080] As a result, when the average cooling rate was 50° C. / min or higher, hot rolling cracks were not observed in the cast slab. Especially when the average cooling rate is above 80°C / min, safe production can also be achieved by increasing the temperature of hot rolling processing and increasing the processing rate, and the range of control conditions can be relaxed. Compared with the above conditions, when ...
Embodiment 3
[0082] The copper alloy No.1 of the present invention obtained according to Example 1 is processed into a box-shaped measurement terminal with a spring part after electroplating a 0.45 μm Cu base film and a 1.2 μm Sn reflow film, and is carried out at a temperature of 190 ° C. 60min heat treatment. This terminal is matched with the terminal that has not been heat-treated, placed in a constant temperature bath at 125°C, and exposed for 330 hours. The low-voltage, low-current impedance and contact load of the terminals at the initial stage and after exposure were measured, and the measurement results are shown in Table 3.
[0083] Low voltage low current impedance (mΩ)
[0084] According to Table 3, the heat treatment process of the terminal after stamping has obvious effects on suppressing the increase of low-voltage and low-current impedance and the reduction of contact load after it is placed at high temperature. In other words, using the copper alloy of the pres...
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