High molecular PTC thermistor without electric arc and method for producing same

Abstract

The invented core material of the macromolecule PTC thermistor consists of the chip possessing the PTC characteristics and the metals foil electrodes pasted on the both sides of core material. The area of the electrode is smaller than the area of the chip. Comparing with the prior art, the etching technique and the stamping etc. techniques are adopted so as to realize the new structure of the PTC thermistor: the large chip and the small electrodes. The new structure increases the creepage distance between the electrodes, and reduces the arc discharging phenomena happened between the electrodes.

Description

technical field [0001] The invention is an electronic component manufacturing method and its products with conductive high molecular polymer composite material as the main raw material, especially relates to a high molecular PTC thermistor and its manufacturing method. Background technique [0002] Generally, a positive temperature coefficient (PTC) phenomenon can be exhibited in a crystalline or semi-crystalline polymer composite material filled with conductive particles. That is to say, within a certain temperature range, its own resistivity will increase with the increase of temperature. These crystalline or semicrystalline polymers include polyethylene, polypropylene, polyvinylidene fluoride, polychlorotrifluoroethylene, and copolymers thereof. Conductive particles include carbon black, graphite, carbon fiber, metal powder (such as silver powder, copper powder, aluminum powder, silver powder, stainless steel powder). At lower temperatures, such conductors exhibit low r...

AI Technical Summary

Problems solved by technology

Usually, the core material of the polymer PTC thermistor is a so-called "sandwich" structure, that is, two layers of metal foil electrodes sandwich a layer of polymer PTC material chip. When the thermistor is in the "off" state, the chip is at high In the state of resistance, the voltage between the two layers of electrode sheets increases. Because the chip is very thin, creepage phenomenon often occurs between the electrodes, and arc discharge occurs. In severe cases, the chip will be damaged and the thermistor will fail.

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