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Solid electrolytic condenser and its mfg. method

A technology of solid electrolysis and manufacturing method, which is applied in the direction of solid electrolytic capacitors, electrolytic capacitors, capacitors, etc., can solve the problems of damaged capacitor characteristics, poor operability of coating insulating resin, and unsuitable for mass production.

Inactive Publication Date: 2004-05-26
PANASONIC CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] When the insulating resin is applied, the resin is sucked into the porous part of the valve metal thin plate body 20, so that the electrostatic capacitance cannot be controlled, and the capacitor characteristics are damaged.
Furthermore, in terms of capacitor manufacturing, the workability of coating insulating resin is poor, and it is not suitable for mass production.

Method used

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  • Solid electrolytic condenser and its mfg. method
  • Solid electrolytic condenser and its mfg. method
  • Solid electrolytic condenser and its mfg. method

Examples

Experimental program
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Embodiment approach 1

[0020] figure 1 This is a cross-sectional view of the solid electrolytic capacitor in Embodiment 1 of the present invention. figure 2 with image 3 These are the top view and the enlarged cross-sectional view of the capacitor. These figures are only schematic diagrams of capacitors, and do not accurately represent the dimensions of each component. A dielectric film 2 is provided on the surface of the porous portion 101 provided on at least one surface of the electron tube metal thin plate body 1. The dielectric film 2 is provided with a solid electrolyte layer 3, and the solid electrolyte layer 3 is provided with a current collector layer 4, thereby forming a capacitor element portion of a solid electrolytic capacitor. The capacitive element part is a basic constituent element of the capacitor functioning as a capacitor. An insulating portion 6 is provided on the periphery of the dielectric film 2, and a solid electrolyte layer 3 is provided on the portion of the dielectric fil...

Embodiment approach 2

[0041] figure 1 This is a cross-sectional view of a solid electrolytic capacitor in Embodiment 2 of the present invention. figure 2 with Figure 4 These are the top view and the enlarged cross-sectional view of the capacitor. These figures are only schematic diagrams of capacitors, and do not accurately represent the dimensions of each component. At least on one surface of the electron tube metal sheet body 1, a dielectric film 2 is provided on the surface of the porous portion 101, the dielectric film 2 is provided with a solid electrolyte layer 3, and the solid electrolyte layer 3 is provided with a current collector Body layer 4. The electron tube metal thin plate body 1, the dielectric film 2, the solid electrolyte layer 3, and the current collector layer 4 constitute a capacitor element part.

[0042] In the capacitor manufactured in the second embodiment, a recess 7 is provided on the periphery of the metal thin plate body 1 of the electron tube, and at least the recess 7 i...

Embodiment approach 3

[0051] Figure 5 This is a cross-sectional view of a solid electrolytic capacitor in Embodiment 3 of the present invention. Figure 6 with Figure 7 These are the three-dimensional view and the enlarged cross-sectional view of the capacitor. A dielectric film 2 is provided on the surface of the porous portion 101 provided on at least one surface of the metal thin plate body 1 of the electron tube, and a solid electrolyte layer 3 is provided on the dielectric film 2. A current collector layer 4 is provided on the solid electrolyte layer 3. The electron tube metal thin plate body 1, the dielectric film 2, the solid electrolyte layer 3, and the current collector layer 4 constitute a capacitor element part.

[0052] The capacitor made in the third embodiment is provided with a plurality of through holes 8 in the tube metal sheet body 1, and the porous part 101 is not formed on the inner wall of the through hole 8 and the tube metal sheet body 1 by using an electroplating method or th...

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Abstract

A dielectric layer is formed on a surface of a porous portion formed at least on a surface of a valve metal sheet. A solid electrolyte layer is formed on the dielectric layer, and a collector layer is formed on the solid electrolyte layer. A first insulating portion is formed on an outer periphery of the dielectric layer, and a solid electrolyte layer is formed on a portion of the dielectric layer corresponding to an opening of the first insulating portion. A portion of the solid electrolyte layer is formed on the first insulating portion. A second insulating portion is formed on the first insulating portion and on the outer periphery of the solid electrolyte layer. A collector layer is formed on a surface of the solid electrolyte layer exposed through an opening of the second insulating portion, thus providing a solid electrolytic capacitor. The solid electrolytic capacitor has less current leakage and a high withstand voltage.

Description

Technical field [0001] The present invention relates to a solid electrolytic capacitor used in various electronic devices and a manufacturing method thereof. Background technique [0002] Picture 11 It is a cross-sectional view of a conventional solid electrolytic capacitor disclosed in JP 2000-243665 A. The single surface or the middle core of the porous valve metal thin plate body 20 such as aluminum and tantalum in the thickness direction is used as an electrode. The surface of the porous part of the tube metal sheet body 20 is provided with a dielectric film 21, a solid electrolyte layer 22 formed of a conductive polymer film is provided on the dielectric film 21, and a current collector layer 23 is provided on the solid electrolyte layer 22 , The current collector layer 23 is provided with an electrode layer made of metal. [0003] When the electrolyte layer 22 is formed, a conductive polymer is formed on the electrode lead-out portion 24 of the valve metal sheet body 20 o...

Claims

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Application Information

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IPC IPC(8): H01G9/028H01G9/00H01G9/04H01G9/042H01G9/052H01G9/15
CPCH01G9/042H01G9/15H01G9/0425
Inventor 藤井达雄三木胜政御堂勇治木村凉
Owner PANASONIC CORP
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