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Laminate for electronic material

A laminated body and resin layer technology, applied to circuit substrate materials, electrical components, layered products, etc., can solve problems such as no consideration of heat resistance of lead-free solder joints, difficulty in shrinkage, and difficulty in adjusting balance

Inactive Publication Date: 2004-06-09
NIPPON STEEL CHEM &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the technology disclosed in this gazette is insufficient in heat resistance for lead-free solder bonding.
[0005] In addition, Japanese Unexamined Patent Publication No. 3-164240 describes a laminate used for a flexible printed circuit board. In order to obtain a laminate with good adhesion between the metal foil and the film and is difficult to crimp, the diamine component constituting the polyimide resin Specific diamines such as m-toluidine are used, but the laminate described in this gazette is formed of a single-layer polyimide layer, and sometimes it is difficult to adjust the balance of various properties required for the laminate. There is also no consideration for heat resistance of lead-free solder joints

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Synthetic example 1

[0082] 65.02 g (0.306 mol) of DADMB and 40.88 g (0.204 mol) of DAPE were dissolved in 1.28 kg of DMAc in a 1.3 L container while stirring. Next, 29.58 g (0.101 mol) of BPDA and 87.73 g (0.402 mol) of PMDA were added. Then, stirring was continued for about 3 hours to carry out the polymerization reaction, and a polyimide precursor resin solution a having an apparent viscosity of 150 poise (29° C.) as measured by an E-type viscometer was obtained.

Synthetic example 2

[0084] 1.3-BAB 22.13 g (0.076 mol) was dissolved in 255 g of DMAc. Next, after cooling the temperature of the solution to 5 to 10° C., 16.71 g (0.047 mol) of DSDA and 6.78 g (0.031 mol) of PMDA were added. Then continue to stir for about 1 hour to carry out the polymerization reaction, and obtain a polyimide precursor resin liquid b of 26.4 poise (25° C.).

Synthetic example 3

[0086] 29.13 g (0.071 mol) of BAPP was dissolved in 294 g of DMAc. Then 3.225 g (0.011 mol) of BPDA and 13.55 g (0.062 mol) of PMDA were added. Then continue to stir for about 3 hours to carry out the polymerization reaction to obtain a polyimide precursor resin liquid c of 35 poise (25° C.).

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Abstract

This invention relates to a laminate which is excellent in heat resistance after moisture absorption required in a lead-free solder joint, and is suitable for use in flexible printed wiring boards or HDD suspensions. The laminate for electronic materials of this invention is constituted of a conductor layer and an insulating resin layer having a polyimide-based resin layer (A) and a polyimide-based resin layer (B). The polyimide-based resin layer (A) constituting the insulating layer includes a polyimide-based resin obtained by reacting a diamine containing 40 mol % or more of 4,4'-diamino-2,2'-dimethylbiphenyl with an aromatic tetracarboxylic acid, and the polyimide-based resin layer (B) includes a polyimide-based resin containing 80 mol % or more of a structural unit generated from bis(4-aminophenoxy)benzene or 2,2-bis[4-(4-aminophenoxy)phenyl]propane, and pyromellitic acid, benzophenonetetracarboxylic acid, diphenylsulfonetetracarboxylic acid or biphenyltetracarboxylic acid.

Description

technical field [0001] The present invention relates to laminates used for flexible printed circuit boards, HDD suspensions, and the like. technical background [0002] The heat resistance of laminates for electronic materials used in flexible printed circuit boards or HDD suspensions is usually placed in an environment where the laminates are placed in a room temperature and humidity environment, and the laminates saturate and absorb moisture in the air. , the premise is that the bonding temperature is about 240°C when the solder bonding is completed after the circuit is formed. This premise is due to the fact that the melting temperature of typical eutectic solder containing lead is 180°C, and bonding is possible before about 200°C. [0003] However, since lead is a hazardous substance, lead-free solder is being developed for practical use. Since the melting temperature of a typical lead-free solder is 200 to 230° C., a bonding temperature of 250° C. or higher is require...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B27/00C08G73/10H05K1/03
CPCY10T428/31721H05K1/0346B32B27/00C08G73/10H05K1/03
Inventor 太田拓平平石克文财部妙子泷山修司壁村惠理宫本和弥松田高泽村太三
Owner NIPPON STEEL CHEM &MATERIAL CO LTD
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