Al technical title is built by PatSnap Al team. It summarizes the technical point description of the patent document.
A technology for connecting materials and inorganic fillers, applied in the direction of epoxy resin glue, adhesive type, film/flake adhesive, etc., can solve the problems of electrode deviation or displacement, defective conductive connection, etc.
Inactive Publication Date: 2004-07-07
DEXERIALS CORP
View PDF1 Cites 2 Cited by
Summary
Abstract
Description
Claims
Application Information
AI Technical Summary
This helps you quickly interpret patents by identifying the three key elements:
Problems solved by technology
Method used
Benefits of technology
Problems solved by technology
[0006] In order to detect the reason, it has been found that when two elements with different linear expansion coefficients are connected by a connecting material, when the temperature of the connecting material is higher than the glass transition temperature (Tg) of the binder resin in the connecting material, the electrode is in place. Deviation or displacement in position, such as is the case when the material is exposed to high temperatures during solder reflow, resulting in a defective conductive connection
Method used
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more
Examples
Experimental program
Comparison scheme
Effect test
preparation example Construction
[0057] * Preparation of the first connecting material *
[0058] Epoxy resin A (a product of Dainippon Ink & Chemicals Inc., trade name 4032D) or epoxy resin B (a product of Yuka Shell Company, trade name Epikote 1009), which is a thermosetting resin, was used as a curing agent. An imidazole-based curing agent (a product of Asashi Ciba, trade name HX-3941HP), a phenoxy resin as a thermoplastic resin (a product of TohtoKasei Co., Ltd., trade name YP50) and Commercial silica (a product of Tatsumori Co., trade name SOE 2, average particle size 0.5 μm) as an inorganic filler was mixed with toluene in the ratio given in Table 1 to prepare a bonding material paste. The prepared paste was coated on a release film, and the coating was dried to obtain a connecting material sheet having a thickness of 40 μm. The resulting sheet of joining material was heated at 200° C. for 5 minutes to cure the material. The properties of the cured joining materials are listed in Table 1.
[0059] ...
Embodiment 3～13 and comparative example 5
[0069] Examples 3-13 and Comparative Example 5, the second connecting material
[0070] * Preparation of the second connecting material *
[0071] The above-mentioned epoxy resin A or epoxy resin C (a product of Yuka Shell-Epoxy Company, trade name EP828) as a thermosetting resin, a curing agent based on imidazole as a curing agent (a product of AsahiCiba Company, trade name named HX-3941HP), as a thermoplastic resin, phenoxy resin (a product of Tohto Kasei Co., Ltd., trade name YP50), as an inorganic filler, commercially available silica (a product of Tatsumori Corporation, Trade name SOE 2, average particle size 0.5 μm) and conductor-coated particles (a product of Nippon Chemical Industrial Co., Ltd, trade name 20GNR-4.6EH, average particle size 5 μm) together with toluene , mixed in the ratio given in Table 2 to prepare the connecting material paste. The prepared paste was coated on a release film, and the coating was dried to obtain a connecting material sheet having...
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
PUM
Property
Measurement
Unit
elastic modulus
aaaaa
aaaaa
glass transition temperature
aaaaa
aaaaa
particle size
aaaaa
aaaaa
Login to view more
Abstract
A connecting material for bonding and connecting elements each having electrodes thereon in a correpondingly confronted relation to each other, while attaining electroconductive connection between the corresponding electrodes, which material has a high heat resistance and can avoid occurrence of faulty electric conductance even in the case of bonding such elements as having a large number of electrodes arranged, thus, at a considerable small interval under such a condition that the bonded assembly is exposed to a service environment of high temperature or of high temperature and high humidity, wherein the said connecting material comprises a thermosetting resin and an inorganic filler and has, after having been cured, characteristic features comprising a modulus of elasticity of 1 - 12 GPa, a glass transition temperature Tg of 120 - 200 DEG C, a coefficient of linear expansion ( alpha 1) of 50 ppm / DEG C or less at temperatures below the Tg and a coefficient of linear expansion ( alpha 2) of 110 ppm / DEG C or less at temperatures above the Tg, wherein the difference ( alpha 2 - alpha 1) does not exceed over 60 ppm / DEG C.
Description
[0001] This application is a divisional application of the Chinese patent application No. 00131897.7 filed on September 16, 2000 entitled "Connecting Material". technical field [0002] The present invention relates to a joining material for bonding and joining together elements to be joined together, wherein each element has a plurality of electrodes opposed to a plurality of electrodes on another element. More specifically, the present invention relates to a joining material containing a thermosetting resin. Background technique [0003] In order to assemble semiconductors such as ICs, LSIs, etc. on a substrate circuit board, it is practiced to directly mount semiconductor chips, such as "bear chips", on the substrate circuit board using connecting materials. At this time, the bonding of the chip and the circuit board is achieved by fixing the positions of the chip and the circuit board so that the electrodes or terminals arranged on the chip and the circuit board are oppo...
Claims
the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to view more
Application Information
Patent Timeline
Application Date:The date an application was filed.
Publication Date:The date a patent or application was officially published.
First Publication Date:The earliest publication date of a patent with the same application number.
Issue Date:Publication date of the patent grant document.
PCT Entry Date:The Entry date of PCT National Phase.
Estimated Expiry Date:The statutory expiry date of a patent right according to the Patent Law, and it is the longest term of protection that the patent right can achieve without the termination of the patent right due to other reasons(Term extension factor has been taken into account ).
Invalid Date:Actual expiry date is based on effective date or publication date of legal transaction data of invalid patent.
Login to view more