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Connecting materials

A technology for connecting materials and inorganic fillers, applied in the direction of epoxy resin glue, adhesive type, film/flake adhesive, etc., can solve the problems of electrode deviation or displacement, defective conductive connection, etc.

Inactive Publication Date: 2004-07-07
DEXERIALS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] In order to detect the reason, it has been found that when two elements with different linear expansion coefficients are connected by a connecting material, when the temperature of the connecting material is higher than the glass transition temperature (Tg) of the binder resin in the connecting material, the electrode is in place. Deviation or displacement in position, such as is the case when the material is exposed to high temperatures during solder reflow, resulting in a defective conductive connection

Method used

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Examples

Experimental program
Comparison scheme
Effect test

preparation example Construction

[0057] * Preparation of the first connecting material *

[0058] Epoxy resin A (a product of Dainippon Ink & Chemicals Inc., trade name 4032D) or epoxy resin B (a product of Yuka Shell Company, trade name Epikote 1009), which is a thermosetting resin, was used as a curing agent. An imidazole-based curing agent (a product of Asashi Ciba, trade name HX-3941HP), a phenoxy resin as a thermoplastic resin (a product of TohtoKasei Co., Ltd., trade name YP50) and Commercial silica (a product of Tatsumori Co., trade name SOE 2, average particle size 0.5 μm) as an inorganic filler was mixed with toluene in the ratio given in Table 1 to prepare a bonding material paste. The prepared paste was coated on a release film, and the coating was dried to obtain a connecting material sheet having a thickness of 40 μm. The resulting sheet of joining material was heated at 200° C. for 5 minutes to cure the material. The properties of the cured joining materials are listed in Table 1.

[0059] ...

Embodiment 3～13 and comparative example 5

[0069] Examples 3-13 and Comparative Example 5, the second connecting material

[0070] * Preparation of the second connecting material *

[0071] The above-mentioned epoxy resin A or epoxy resin C (a product of Yuka Shell-Epoxy Company, trade name EP828) as a thermosetting resin, a curing agent based on imidazole as a curing agent (a product of AsahiCiba Company, trade name named HX-3941HP), as a thermoplastic resin, phenoxy resin (a product of Tohto Kasei Co., Ltd., trade name YP50), as an inorganic filler, commercially available silica (a product of Tatsumori Corporation, Trade name SOE 2, average particle size 0.5 μm) and conductor-coated particles (a product of Nippon Chemical Industrial Co., Ltd, trade name 20GNR-4.6EH, average particle size 5 μm) together with toluene , mixed in the ratio given in Table 2 to prepare the connecting material paste. The prepared paste was coated on a release film, and the coating was dried to obtain a connecting material sheet having...

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PUM

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Abstract

A connecting material for bonding and connecting elements each having electrodes thereon in a correpondingly confronted relation to each other, while attaining electroconductive connection between the corresponding electrodes, which material has a high heat resistance and can avoid occurrence of faulty electric conductance even in the case of bonding such elements as having a large number of electrodes arranged, thus, at a considerable small interval under such a condition that the bonded assembly is exposed to a service environment of high temperature or of high temperature and high humidity, wherein the said connecting material comprises a thermosetting resin and an inorganic filler and has, after having been cured, characteristic features comprising a modulus of elasticity of 1 - 12 GPa, a glass transition temperature Tg of 120 - 200 DEG C, a coefficient of linear expansion ( alpha 1) of 50 ppm / DEG C or less at temperatures below the Tg and a coefficient of linear expansion ( alpha 2) of 110 ppm / DEG C or less at temperatures above the Tg, wherein the difference ( alpha 2 - alpha 1) does not exceed over 60 ppm / DEG C.

Description

[0001] This application is a divisional application of the Chinese patent application No. 00131897.7 filed on September 16, 2000 entitled "Connecting Material". technical field [0002] The present invention relates to a joining material for bonding and joining together elements to be joined together, wherein each element has a plurality of electrodes opposed to a plurality of electrodes on another element. More specifically, the present invention relates to a joining material containing a thermosetting resin. Background technique [0003] In order to assemble semiconductors such as ICs, LSIs, etc. on a substrate circuit board, it is practiced to directly mount semiconductor chips, such as "bear chips", on the substrate circuit board using connecting materials. At this time, the bonding of the chip and the circuit board is achieved by fixing the positions of the chip and the circuit board so that the electrodes or terminals arranged on the chip and the circuit board are oppo...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02B32B1/00C09J7/10C09J11/04C09J201/00H01L21/60H05K3/32
CPCH01L2924/01019H01L2224/293C09J2201/602H05K2201/068H05K2201/0129C09J2463/00H01L2924/01079Y10S525/903H05K2201/0209H05K3/323C09J7/00C09J7/10C09J163/00C08G59/5073C08G2650/56C09J2301/314C08K3/36C08L71/00C08L63/00C09J9/02
Inventor 八木秀和武市元秀筱崎润二
Owner DEXERIALS CORP
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