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Manufacturing method of flexible micro-electromechanical system changer

A micro-electromechanical system and transducer technology, applied in the manufacture/assembly of piezoelectric/electrostrictive devices, piezoelectric/electrostrictive transducers, piezoelectric/electrostrictive transducer microphones, etc., capable of Address issues such as increased manufacturing process complexity and cost

Inactive Publication Date: 2004-08-04
SAMSUNG ELECTRONICS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the disadvantage of this approach is the use of conventional silicon MEMS processes with high temperature processing and an additional polymer process in the final step, thereby increasing the complexity and cost of the overall manufacturing process

Method used

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  • Manufacturing method of flexible micro-electromechanical system changer
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Embodiment Construction

[0025] Korean Patent Application No. 2002-58316, filed on September 26, 2002, entitled "Flexible MEMS Transducer Manufacturing Method", is incorporated by reference in this application.

[0026] The present invention will be described in detail below with reference to the accompanying drawings, in which preferred embodiments of the present invention are shown. However, the invention may be embodied in different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this description will be clear, complete, and will fully convey the scope of the invention to those skilled in the art. In the drawings, the thickness of layers and regions are exaggerated for clarity. It will also be understood that when a layer is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present. The same symbols refer to the same elements in...

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Abstract

A method for manufacturing a flexible MEMS transducer includes forming a sacrificial layer (210) on a flexible substrate, sequentially depositing a membrane layer (220), a lower electrode layer (230), an active layer (240), and an upper electrode layer (250) on the sacrificial layer by PECVD, sequentially patterning the upper electrode layer, the active layer, and the lower electrode layer, depositing an upper protective layer (260) to cover the upper electrode layer, the lower electrode layer, and the active layer, patterning the upper protective layer to be connected to the lower electrode layer and the upper electrode layer, and then depositing a connecting pad layer and patterning the connecting pad layer to form a first connecting pad (272) to be connected to the lower electrode layer and a second connecting pad (271) to be connected to the upper electrode layer; and patterning the membrane layer to expose the sacrificial layer and removing the sacrificial layer.

Description

technical field [0001] The present invention relates to microelectromechanical systems (MEMS) structures. More particularly, the present invention relates to a MEMS transducer formed on a flexible substrate, a method of manufacturing the same, and a flexible MEMS wireless microphone incorporating the MEMS transducer. Background technique [0002] As the demand for extremely small devices increases, semiconductor processing technology using microfabrication technology is used to integrate tiny devices. The field of microelectromechanical systems (MEMS) is the field of manufacturing and testing tiny sensors and actuators, which are on the order of micrometers (μm) in size and employ electromechanical structures using micromachining techniques in semiconductor processing, especially in integrated circuit technology. [0003] The micromachining techniques employed in MEMS are broadly classified into two categories. The first micromachining technique is bulk micromachining by s...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04R17/00B81B3/00H01L41/09H01L41/45H04R17/02H04R31/00
CPCH01L41/0973B81C1/00142H01L41/094H01L41/45B81B2201/0257H10N30/308H10N30/306H10N30/081H04R31/00
Inventor 南润宇李锡汉
Owner SAMSUNG ELECTRONICS CO LTD
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