Photosensitive resin composition and laminating article thereof

A technology of photosensitive resin and composition, applied in photosensitive material processing, optics, opto-mechanical equipment, etc., can solve problems such as short circuit and pipeline blockage in developing tank, and achieve excellent dispersion stability, good etching solution resistance, resolution good effect
CN1940723AActive Publication Date: 2007-04-04ASAHI KASEI KK
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
ASAHI KASEI KK
Publication Date
2007-04-04

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Abstract

The purpose of the present invention is to provide a photosensitive film with good resolution after development, excellent dispersion stability to the developer, no aggregates, excellent flexibility of the cured film, hole capping and good etchant resistance. A photosensitive resin composition, a photosensitive resin laminate having a photosensitive resin layer composed of the composition, a method of forming a resist pattern using the laminate, and a method of producing a conductive pattern. The present invention solves the above-mentioned problems by providing the following photosensitive resin composition, that is, a photosensitive resin composition characterized in that it contains (a) binder resin: 10 to 90% by mass, and its carboxyl group content is The acid equivalent is 100 to 600, contains benzyl (meth)acrylate as a copolymerization component, and has a weight average molecular weight of 5,000 to 500,000, (b) photopolymerizable unsaturated compound: 5 to 70% by mass, (c) as photopolymerizable unsaturated compound: The specific compound of the polymerization initiator is 0.1 to 20% by mass.
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Description

technical field

[0001] The present invention relates to a photosensitive resin composition and uses thereof, specifically, to a photosensitive resin laminate suitable for manufacturing printed wiring boards, flexible substrates, lead frames, etc., and a method for forming a resist pattern using the same, and manufacturing a conductive pattern A method for manufacturing a printed wiring board, a method for manufacturing a lead frame, and a method for manufacturing a semiconductor package. Background technique

[0002] In electronic devices such as personal computers and mobile phones, printed wiring boards are used for mounting components, semiconductors, and the like. As a resist used in the production of printed wiring boards and the like, so-called dry film resists (hereinafter abbreviated as DFR) formed of a support, a photosensitive resin layer, and a protective layer have been conventionally used. DFR is generally prepared by laminating a photosensitive resin layer on ...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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