Photosensitive resin composition and laminating article thereof
A technology of photosensitive resin and composition, applied in photosensitive material processing, optics, opto-mechanical equipment, etc., can solve problems such as short circuit and pipeline blockage in developing tank, and achieve excellent dispersion stability, good etching solution resistance, resolution good effect
Active Publication Date: 2007-04-04
ASAHI KASEI KK
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Problems solved by technology
When the condensate reattaches to the substrate and performs capping and etching operations, it may cause a short circuit and sometimes block the piping of the developing tank.
Therefore, in order to reduce aggregates, as photopolymerizable unsaturated compounds, attempts have been made to use alkylphenol-based monofunctional monomers with good dispersibility in developing solutions (Patent Document 1), and to use phenoxy-based monofunctional monomers. Functional monomers (Patent Document 2), but none of them can meet the requirements
[0009] In addition, Patent Document 3 discloses a photosensitive resin composition using a binder resin containing benzyl methacrylate as a copolymerization component, and Patent Document 4 discloses a photosensitive resin composition using an acridine compound. However, the photosensitive resin compositions disclosed in these documents cannot fully meet the requirements of the following photosensitive resin compositions. High resolution, excellent performance in the balance of various effects such as good flexibility, hole covering and good etchant resistance
Method used
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[0151] Hereinafter, the preparation method of the evaluation sample of the Example and the comparative example, and the evaluation method and evaluation result with respect to the obtained sample are demonstrated.
[0152] 1. Production of samples for evaluation
[0153] The photosensitive resin laminates in Examples and Comparative Examples were produced as follows.
[0154]
[0155] Prepare the compounds shown in Table 1, uniformly stir and mix the photosensitive resin composition shown in Table 2, and use a bar coater to uniformly coat the polyterephthalic acid as a support with a thickness of 20 μm. The surface of the ethylene glycol film was dried in a dryer at 95° C. for 4 minutes to form a photosensitive resin layer. The thickness of the photosensitive resin layer was 40 μm.
[0156] In the composition of Table 1, MEK represents methyl ethyl ketone, and the parts by mass of P-1 to P-5 in Table 2 are values including MEK.
[0157] Then, on the surface of the photo...
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Abstract
The purpose of the present invention is to provide a photosensitive film with good resolution after development, excellent dispersion stability to the developer, no aggregates, excellent flexibility of the cured film, hole capping and good etchant resistance. A photosensitive resin composition, a photosensitive resin laminate having a photosensitive resin layer composed of the composition, a method of forming a resist pattern using the laminate, and a method of producing a conductive pattern. The present invention solves the above-mentioned problems by providing the following photosensitive resin composition, that is, a photosensitive resin composition characterized in that it contains (a) binder resin: 10 to 90% by mass, and its carboxyl group content is The acid equivalent is 100 to 600, contains benzyl (meth)acrylate as a copolymerization component, and has a weight average molecular weight of 5,000 to 500,000, (b) photopolymerizable unsaturated compound: 5 to 70% by mass, (c) as photopolymerizable unsaturated compound: The specific compound of the polymerization initiator is 0.1 to 20% by mass.
Description
technical field [0001] The present invention relates to a photosensitive resin composition and uses thereof, specifically, to a photosensitive resin laminate suitable for manufacturing printed wiring boards, flexible substrates, lead frames, etc., and a method for forming a resist pattern using the same, and manufacturing a conductive pattern A method for manufacturing a printed wiring board, a method for manufacturing a lead frame, and a method for manufacturing a semiconductor package. Background technique [0002] In electronic devices such as personal computers and mobile phones, printed wiring boards are used for mounting components, semiconductors, and the like. As a resist used in the production of printed wiring boards and the like, so-called dry film resists (hereinafter abbreviated as DFR) formed of a support, a photosensitive resin layer, and a protective layer have been conventionally used. DFR is generally prepared by laminating a photosensitive resin layer on ...
Claims
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IPC IPC(8): G03F7/027G03F7/20G03F7/26H01L21/00
Inventor 山田有里五十岚勉
Owner ASAHI KASEI KK
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