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Polishing composition

A polishing composition and compound technology, applied in the field of polishing compositions, can solve the problems that the protective film formation effect of organic phosphoric acid is not very strong, and the degree of corrosion and scratch inhibition is not very high.

Inactive Publication Date: 2004-10-13
FUJIMI INCORPORATED
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Problems solved by technology

[0004] However, since the protective film-forming effect of organic phosphoric acid is not very strong, the degree of inhibition of corrosion and scratches is not very high

Method used

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Examples

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Embodiment Construction

[0008] An embodiment of the present invention will now be described.

[0009] According to this example, a polishing composition comprising silicon dioxide, a phosphorus-containing compound, an ammonium salt, hydrogen peroxide, and water is used to polish, for example, a substrate of a magnetic disk. This substrate may be a substrate formed by providing a layer of nickel-phosphorus electroless plating on a blank member composed of aluminum alloy, or a layer composed of nickel-iron provided on a blank member to form a substrate, or containing boron carbide or carbon matrix.

[0010] The silica mentioned above is an abrasive used in the mechanical polishing of an item. In addition to silica, ceria, diamond, alumina and the like can be used as abrasives. However, polishing compositions containing ceria instead of silica cannot be used for polishing substrates at high speeds. Polishing compositions containing diamond or alumina but no silica often produce surface defects such a...

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Abstract

A polishing composition for use in polishing a substrate for a magnetic disk comprises silicon dioxide; a first compound containing at least one compound selected from the group consisting of orthophosphoric acid, diphosphoric acid, polyphosphoric acid, metaphosphoric acid, methyl acid phosphate, ethyl acid phosphate, ethyl glycol acid phosphate, phytic acid, 1-hydroxyethylidene-1,1-diphosphonic acid, sodium metaphosphate and acidic sodium hexametaphosphate; a second compound containing at least on salt produced by a neutralisation reaction of each of orthophosphoric acid, diphosphoric acid, polyphosphoric acid, metaphosphoric acid, methyl acid phosphate, ethyl acid phosphate, ethyl glycol acid phosphate, phytic acid, 1-hydroxyethylidene-1,1-diphosphonic acid with ammonia hydrogen peroxide; and water. The polishing composition may further contain a polishing accelerator e.g. citric acid, succinic acid. Also shown is a method for polishing a substrate using the above composition.

Description

technical field [0001] The present invention relates to a polishing composition useful for polishing substrates such as magnetic disks. Background technique [0002] Since magnetic disks can be used as hard disks, and hard disks can be used as storage devices for computers, there is a strong demand for high recording density. Therefore, substrates for magnetic disks are required to have superior surface properties, for example, less corrosion or scratches. [0003] Japanese Laid-Open Patent Publication No. 2002-327170 discloses an improved polishing composition to meet this need of the substrate. Such polishing compositions contain abrasives, an oxidizing agent, an organic phosphoric acid (eg, diethylenetriamine pentamethylene phosphoric acid), and water. When the substrate is polished with this polishing composition, a protective film resulting from the reaction of organic phosphoric acid is formed on the surface of the substrate, whereby corr...

Claims

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Application Information

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IPC IPC(8): B24B37/00C09G1/02C09K3/14G11B5/84
CPCG11B5/8404C09G1/02C09K3/1463
Inventor 平野淳一松波靖横道典孝大胁寿树
Owner FUJIMI INCORPORATED
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