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Strain tester for microelectronic material and hig temp creep of soldering joint

A brazed joint, high temperature creep technology, applied in the field of high temperature creep performance testing, can solve the problem of no patents and reports

Inactive Publication Date: 2005-01-12
BEIJING UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] At the same time, the structure of the material plays a decisive role in the performance, so observing the changes of the structure of the microelectronic materials and brazing joints with temperature and time is of great significance to the research and discussion of the performance of microelectronic materials and brazing joints , but there are no related patents and reports

Method used

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  • Strain tester for microelectronic material and hig temp creep of soldering joint
  • Strain tester for microelectronic material and hig temp creep of soldering joint
  • Strain tester for microelectronic material and hig temp creep of soldering joint

Examples

Experimental program
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Effect test

example 1

[0043] Example 1 Determination of stable creep rate of Sn-3.8Ag-0.7Cu miniature single lap brazed joint.

[0044] The measurement steps are as follows:

[0045] 1) Creep brazed joints and their preliminary treatment

[0046] The shape and dimensions of the miniature single lap solder joint 20 are described in the examples.

[0047] Cut the Sn-3.8Ag-0.7Cu thin strip with a thickness of 0.1mm into a square of 1mm×1mm. sequentially with 50% HNO 3 Wash the surface of the copper sheet with aqueous solution and alcohol to remove the oxide film. Pre-coat IF710 solder resist on the soldering surface of the copper sheet, leaving an area of ​​1mm at the end 2 of welding area. Subsequently, 22% ZnCl was dropped into the welding area 2 +2% NH 4 Cl aqueous solution brazing flux, sandwich the cut square Sn-3.8Ag-0.7Cu thin strip between two copper sheets. Using ZnCl 2 +NH 4 Cl corrosive flux. The brazing process generally ensures that the temperature of the brazing joint is kept ...

example 2

[0062] Example 2: Growth of SnCu-based composite solder with Ni particles on Cu plate intermetallic compounds

[0063] Specific steps are as follows:

[0064] 1) Preparation of test materials and sample 20

[0065]The test material is SnCu-based composite solder reinforced with Ni particles, wherein the Ni particle size is 1 μm, and the volume percentage of Ni is 3%. Take the spread sample of the composite solder alloy, cut it along the center of the sample (0.2mm red copper foil is used as the mother board for the spread test), and cold mount it in the brass tube with epoxy resin. Grind with 200#-1000# metallographic water sandpaper, and then polish with 2.5μm, 1.0μm, 0.5μm emery polishing paste. with 4% HNO 3 The alcohol solution corrodes for about 1 to 2 seconds.

[0066] 2) Test conditions

[0067] The test temperature is 100°C.

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Abstract

The testing equipment is capable of taking picture in real time for observed structural change occurred in creep deformation and creep process. The equipment includes main body and peripheral equipment. The main body is composed of heating device, sample, load, loading supporter, and micro imaging filming device including metallurgical microscope. Peripheral equipment consists of stabilized voltage supply, temperature controller, and thermocouple. The voltage supply is connected to temperature controller and micro imaging filming device. One output of the temperature controller is connected to thermocouple and sample welding, and another output is connected to heating device.

Description

1. Technical field [0001] The device belongs to the technical field of material performance testing, and is particularly suitable for high-temperature creep performance testing of microelectronic materials and brazed joints. 2. Background technology [0002] The mechanical properties of materials at high temperatures are an extremely important part of research and evaluation of material properties, among which the high temperature creep properties of materials are a very important indicator. Brazed joints undergo temperature cycles and power cycles during service, and the main failure mode is thermal fatigue fracture. The deformation and damage experienced during thermal fatigue are partly provided by creep deformation. For effective evaluation and life prediction of brazed joints and their corresponding microelectronic materials, the influence of creep must be considered, especially for alloys that belong to high-temperature creep at relatively low temperatures (such as so...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01N3/00G01N25/00
Inventor 史耀武阎焉服陈志刚夏志东刘建萍郭福雷永平
Owner BEIJING UNIV OF TECH