Prepn. process for magnetic core solenoidal microinduction element of micro-electromechanical system

A micro-electromechanical system and micro-inductance technology, applied in the field of microelectronics, can solve the problems of difficulty in obtaining high-performance micro-inductance devices, high curing temperature of insulating materials, and influence on the performance of coils and magnetic cores, so as to solve the problems of open circuit, improve flatness, The effect of improving accuracy

Inactive Publication Date: 2005-01-12
SHANGHAI JIAO TONG UNIV
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Problems solved by technology

Moreover, in the manufacturing process, the curing temperature of the insulating material used by the author is as high as 350 ° C, which will affect the performance of the coil and magnetic core, so it is difficult to obtain high-performance micro-inductance devices

Method used

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  • Prepn. process for magnetic core solenoidal microinduction element of micro-electromechanical system
  • Prepn. process for magnetic core solenoidal microinduction element of micro-electromechanical system
  • Prepn. process for magnetic core solenoidal microinduction element of micro-electromechanical system

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Embodiment Construction

[0049] The specific structure of the present invention will be further described below in conjunction with the accompanying drawings.

[0050] Micro-inductance device structure of the present invention such as figure 1 As shown, it is composed of substrate 1, pin 2, solenoid coil 3, and magnetic core 4. The solenoid coil 3 is based on the substrate 1, and two groups of connected three-dimensional coils are symmetrically wound around the rectangular closed magnetic core 4. A three-dimensional solenoid coil 3 , the two ends of the solenoid coil 3 are connected to the pin 2 .

[0051] figure 2 for figure 1 The sectional view of the structure along the direction A-A shows the longitudinal three-dimensional structure of the solenoid coil 3 of the present invention. Such as figure 2 As shown, the bottom coil 5 is arranged on the plane of the substrate 1, and the three-dimensional solenoid coil 3 is surrounded by the magnetic core 4. The solenoid coil 3 is formed by connecting ...

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Abstract

Microinductor is composed of substrate, pins, coils and magnetic core. Following techniques are adopted in fabricating procedures: processing silicon chip by using MEMS technique to obtain alignment signs in two sides in order to raise alignment precision of exposure, physical etching to remove seed layer, polishing boding conductor at one time. Two groups of connected 3D solenoid are wound on rectangular or annular closed magnetic core symmetrically. Upper coil and lower coil is connected through boding conductor. Upper coil, lower coil and conductor are separated from magnetic core by polyimide insulating material. The invention prevents undercutting phenomena caused by wet-process etching technique. The invention solves issue of enwinding 3D solenoid and insulation between layers, plating part having high ratio of depth to width so as to raise inductance performance greatly.

Description

technical field [0001] The invention relates to a preparation method of a micro-electromechanical system (MEMS) magnetic core solenoid micro-inductance device. The prepared miniaturized and integrated magnetic core micro-inductance device is a key component for realizing a miniaturized DC-DC converter, and can be widely used Power supply for wireless communication, military / aerospace equipment, computer / peripheral equipment and other portable electronic products. It belongs to the technical field of microelectronics. Background technique [0002] In recent years, miniaturized portable electronic products such as mobile communication products CDMA (Code Division Multiple Access, Code Division Multiple Access), laptops, network products ADSL (Asymmetrical Digital Subscriber Loop, Asymmetrical Digital Subscriber Loop), microprocessors, digital cameras, flash memory Components, audio, chargers, etc. are more and more popular and concerned by the market. The miniaturization and...

Claims

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Application Information

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IPC IPC(8): B81C1/00B81C99/00H01F17/04H01F37/00H01F41/00
Inventor 周勇高孝裕周海涛陈吉安
Owner SHANGHAI JIAO TONG UNIV
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