Dipping-sealing wax for electronic element coil

A technology for electronic components and encapsulation wax, applied in other chemical processes, chemical instruments and methods, etc., can solve the problems of high cost performance, poor toughness and plasticity of dipping and encapsulation materials, poor high temperature performance and toughness and plasticity, etc. Excellent electrical insulation properties, stable electrical properties, no mechanical impurities

Active Publication Date: 2005-05-04
CHINA PETROLEUM & CHEM CORP +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The prior art generally only uses commercial paraffin wax or microcrystalline wax. Although the price is cheap, it has defects such as poor high-temperature performance and toughness and plasticity. It is easy to lose at working temperature and easy to break under external force.
Introduction of prior art The materials used for sealing coils dedicated to electronic components

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0025] Embodiment: (below all represent by weight percentage)

[0026] experiment method

[0027] The following test methods are the usual ones for testing waxes used in the electronics industry used in the examples.

[0028] Dropping melting point GB / T 8036

[0029] Softening point GB / T 4507

[0030] Penetration GB / T 4985

[0031] Mechanical impurities GB / T 511

[0032] Corrosion test GB / T 5096

[0033] Dielectric constant GB / T 1409

[0034] Volume resistivity GB / T 1410

[0035] The preparation of the impregnated encapsulating wax in Examples 1, 2, 3, 4, and 5 of the present invention is to add raw materials in sequence at a temperature of about 110°C and mix and melt to form a uniform and transparent wax liquid, which is cooled and formed after filtration. .

Example Embodiment

[0037] Example 1

[0038] 80 # Microcrystalline wax, dropping point 82.4°C (Nanchong Oil Refinery) 77.5%

[0039] Medical Vaseline, dropping point 67.5°C (Nanyang Oil Refinery) 20%

[0040] Polyisobutylene, average molecular weight 20000 (Jinzhou Refinery) 2.5%

Example Embodiment

[0041] Example 2

[0042] 80 # Microcrystalline Wax (Nanchong Oil Refinery) 80%

[0043] Medical Vaseline, dropping point 65°C (Lanzhou Refinery and Chemical General Plant) 10%

[0044] Polyisobutylene, average molecular weight 1000 (Jinzhou Refinery) 10%

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PUM

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Abstract

The invention relates to a kind of impregnation enveloping wax combination used for electronic components, which contains petroleum wax, petroleum resin, and adhesion promoter. The impregnation enveloping wax of the invention has the advantages such as high drop melting point, excellent high-temperature property, fine electrical property, low melting viscosity, good adhesivity, fine moisture resistance, and so on. Coil impregnation-enveloping materials for exclusive use to existing technology electronic components all take resin as main materials, and the impregnation-enveloping materials have higher cost. The impregnation encapsulating wax of the invention adapts to the impregnation and envelopment of inductance coil, mid-frequency and high frequency electric coil, and other electronic components.

Description

technical field [0001] The invention relates to an impregnating and encapsulating wax, which is especially suitable for impregnating and encapsulating inductance coils, intermediate frequency and high frequency electronic coils and other electronic coils. Background technique [0002] In the production of inductance coils, it is necessary to fill the coil gap with impregnated encapsulating wax, and at the same time encapsulate the coils. The prior art generally only uses commercial paraffin wax or microcrystalline wax. Although the price is cheap, it has defects such as poor high-temperature performance and toughness and plasticity. Introduction of prior art The materials used for sealing coils dedicated to electronic components all use resin as the main component. For example, in the sealing methods introduced in US 4115175 and US 5656350, resins are used to encapsulate coils. For the increasingly competitive electronic market, it is difficult to meet the requirements of u...

Claims

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Application Information

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IPC IPC(8): C08L91/06C09K3/10
Inventor 杨光李尚勇胡伟龙李莉
Owner CHINA PETROLEUM & CHEM CORP
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