Method for seed layer removal for magnetic heads

Abstract

The present invention relates to a method for seed layer removal of a magnetic head in which plated parts of the magnetic head are manufactured using a seed layer sensitive to reactive ion etching removal techniques. The seed layer comprises tungsten or titanium and is fabricated by a sputter deposition process, and the seed layer is electrically conductive, wherein plated components (such as induction coil components and magnetic poles) are effectively plated on top of the photolithographically formed components fabricated on the seed layer. on the photoresist trench. After electroplating, the photoresist layer is removed using standard wet chemical processing. The active ion etching process of fluorine-based substances is used to remove more seed layers, and the gaseous tungsten fluoride or titanium fluoride compound removal products are formed in the fluorine RIE process. Since the gaseous fluoride is not redeposited, the problem of redeposition of the seed layer along the sides of the plated part is overcome. The invention also includes enhanced two-part seed layers, wherein the lower part is tungsten, titanium or tantalum and the upper part comprises the material making up the part to be plated.

Description

technical field [0001] The present invention relates generally to hard disk drive head fabrication and, more particularly, to the fabrication and removal of seed layers for plating head components such as induction coils and pole tips. Background technique [0002] Several components of the magnetic head are usually manufactured using an electroplating process, and the initial step in such electroplating processes is usually the deposition of a conductive seed layer. A patterned photoresist is photolithographically structured on the seed layer, and the desired head components such as induction coils or poles are thereafter plated on the seed layer within the patterned photoresist layer. After plating of the part, the photoresist layer is removed, followed by removal of the portion of the seed layer not covered by the plated part. A seed layer removal step needs to be performed to prevent electrical shorting of the components. In prior art fabrication processes, the seed la...

AI Technical Summary

Problems solved by technology

Furthermore, the above-mentioned problems are exacerbated by the need to ensure that the seed layer is effectively removed from between plated parts, and overetching is often severe.

Additionally, overetching may damage layers and structures under the seed layer

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