Method for preparing welded heat radiator

Abstract

The preparation process of welded heat radiator includes the following steps: 1) preparing base seat, fins and solder with welding flux; 2) setting the solder between the base seat and fins; 3) heating the solder to connect the fins to the base seat and to form the heat radiator; 4) maintaining the temperature of heat radiator to lower the temperature to the smelting point of the solder; and 5) cooling the heat radiator to lower the temperature to room temperature. The said preparation process can eliminate holes and bubbles produced during welding and make the crystal grain of the solder become large to lower the heat resistance.

Description

technical field [0001] The invention relates to a welding preparation method for a radiator, in particular to a method for welding between aluminum materials and aluminum materials, or between aluminum materials and copper materials, so as to reduce heat dissipation of the radiator. Soldering preparation method of resistance radiator. Background technique [0002] As we all know, electronic components in electronic devices, such as the central processing unit (CPU) on the motherboard of a computer, need to be assembled with a heat dissipation module to cool down the high temperature generated during use. The heat dissipation module has a heat sink, and the heat sink includes an aluminum or copper base against the central processing unit, and aluminum heat dissipation fins welded to the base. [0003] The welding preparation method of the known heat sink, first, before welding, in order to facilitate welding and fixing the heat dissipation fins to the base, the aluminum heat...

AI Technical Summary

Problems solved by technology

Since it is difficult to apply solder paste and flux, the difficulty of the work is increased, and the lead (Pb) material of the solder will pollute the environment

During welding, due to the high ambient temperature of the welding operation, the flux will liquefy, infiltrate and carbonize, resulting in a yellowish and unclean appearance of the radiator after welding, which is difficult to clean and increases the processing cost

Especially in the high temperature process of soldering, the solder is prone to produce voids or air bubbles, resulting in greatly reduced heat dissipation efficiency

Moreover, in the cooling process after soldering, the crystal particles of the solder are small, and the total contact area between the crystal particles is large, resulting in an increase in thermal resistance and even cracking, which seriously affects the heat dissipation effect

In addition, when the radiator is assembled with a cooling fan to form an integral cooling module, it is necessary to develop fasteners and other parts, resulting in an increase in mold and assembly costs

[0005] The above-mentioned known heat sinks have been difficult to reduce the thermal resistance of the heat sink in terms of the

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