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Preparation method of photo sensitive resin binding agent sand wheel

A photosensitive resin and binder technology, applied in grinding/polishing equipment, manufacturing tools, metal processing equipment, etc., can solve the problems of high production energy consumption and long time, and achieve increased grinding wheel strength, reduced manufacturing time, and improved manufacturing. The effect of the environment

Inactive Publication Date: 2005-10-26
ZHEJIANG UNIV OF TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] In order to overcome the disadvantages of high energy consumption and long time in the production method of the existing grinding wheel, the present invention provides a method for preparing a photosensitive resin bonded grinding wheel with low energy consumption and short production time

Method used

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  • Preparation method of photo sensitive resin binding agent sand wheel

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Comparison scheme
Effect test

Embodiment 1

[0016] refer to figure 1 , a preparation method of photosensitive resin bond grinding wheel, the method comprises the following steps:

[0017] (1), making the grinding wheel base 1: metal base size: diameter 75mm, thickness: 0.15mm; overall size of the grinding wheel: diameter 75mm, thickness 0.4mm;

[0018] (2), material mixing: formula, with 15g commercially available photosensitive resin bonding agent, the artificial diamond 2.29g that abrasive grain size specification is 6-12 μ m stirs above-mentioned material with mixer, and abrasive tool concentration is 25%;

[0019] (3) Curing molding: install the evenly stirred mixture 2 and the substrate 1 on a self-made rotating platform, rotate the platform, and evenly spin coat the surface of the outer ring of the metal substrate (65mm-75mm range), using Japanese HOYO -EX250 ultraviolet irradiation device produced by SCHOTT company, the wavelength distribution range is 200nm to 500nm, the light intensity is 2.4w / cm, the curing...

Embodiment 2

[0022] 1. Making the grinding wheel base 1: metal base size: diameter 75mm, thickness: 0.15mm; overall size of the grinding wheel: diameter 75mm, thickness 0.4mm;

[0023] 2. Mixing: formula, mix 15g of commercially available photosensitive resin binder, 4.9g of silicon dioxide micropowder with an abrasive grain size of 6-12μm, stir the above materials evenly with a mixer, and the abrasive concentration is 50%;

[0024] 3. Curing molding: install the evenly stirred mixture 2 and substrate 1 on a self-made rotating platform, rotate the platform, and evenly spin coat the surface of the outer ring of the metal substrate (65mm-75mm range), using Japanese HOYO-SCHOTT The EX250 ultraviolet irradiation device produced by the company has a wavelength distribution range of 200nm to 500nm, a light intensity of 2.4w / cm, and a curing time of 15s. Light curing molding.

[0025] Grinding wheel use: precision cutting of glass, ceramics and silicon wafers.

Embodiment 3

[0027] refer to figure 1 , a preparation method of photosensitive resin bond grinding wheel, the method comprises the following steps:

[0028] (1), making the grinding wheel base 1: metal base size: diameter 75mm, thickness: 0.15mm; overall size of the grinding wheel: diameter 75mm, thickness 0.4mm;

[0029] (2), mixing: formula, 15g of commercially available photosensitive resin binder, 7.19g of silicon carbide with an abrasive particle size specification of 6-12 μm, stir the above materials evenly with a mixer, and the abrasive concentration is 75%;

[0030] (3) Curing molding: install the evenly stirred mixture 2 and the substrate 1 on a self-made rotating platform, rotate the platform, and evenly spin coat the surface of the outer ring of the metal substrate (65mm-75mm range), using Japanese HOYO -EX250 ultraviolet irradiation device produced by SCHOTT company, the wavelength distribution range is 200nm to 500nm, the light intensity is 2.4w / cm, the curing time is 15s, ...

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Abstract

A process for preparing the adhesive disc with photosensitive resin as adhesive includes such steps as preparing the metallic base of abrasive disc, mixing photosensitive resin with abrasive particles, stirring, installing said metallic base onto rotary platform, rotating, coating said mixture on one surface of metallic base, optical solidifying, coating the mixture on its back, and optical solidifying.

Description

1. Technical field [0001] The invention relates to a method for preparing a metal base grinding wheel, and is especially suitable for the preparation of a photosensitive resin bonded grinding wheel. 2. Background technology [0002] Abrasives are the main tools used in large quantities in the machinery manufacturing industry and are also the main consumables. The grinding wheel is the main representative of abrasives. At present, the binder of resin bonded grinding wheel used at home and abroad mainly adopts thermosetting resin represented by aldehyde phenol resin, and the abrasive grains are combined by heating and sintering. This manufacturing process is as follows: mixing materials, mixing them with a mixer The abrasive grains are evenly mixed with the resin bond; molding, put the uniformly mixed abrasive grains and resin into the molding mold, and press to form by a press; solidify, the pressed cutting grinding wheel is heated and kept in an electric heating furnace, and...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B24D18/00
Inventor 姚春燕彭伟
Owner ZHEJIANG UNIV OF TECH
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