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Thermoset resin composition and multi-layer printed circuit board used thereof

A resin composition, thermosetting technology, applied in printed circuit parts, secondary processing of printed circuits, epoxy resin coatings, etc., can solve problems such as large strain, reduce elastic coefficient, prevent interlayer peeling, and high reliability. Effect

Active Publication Date: 2005-11-02
TAIYO HLDG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

This composition has excellent bonding properties, and there is no shrinkage due to volatilization of organic solvents, but due to catalyst curing caused by imidazole, the strain in the cured product is large, and it cannot be said to have sufficient insulation reliability and heat resistance. Sexual substances, hope to further improve

Method used

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  • Thermoset resin composition and multi-layer printed circuit board used thereof
  • Thermoset resin composition and multi-layer printed circuit board used thereof
  • Thermoset resin composition and multi-layer printed circuit board used thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1、2 and comparative example 1、2

[0051] After pre-mixing the additive components shown in the following Table 1, they were ground and dispersed with a 3-roll kneader to obtain each thermosetting resin composition.

[0052] Example

comparative example

1

2

1

2

Bisphenol A type epoxy resin *1

42.5

80.0

50

45

Bisphenol F type epoxy resin *2

42.5

-

50

45

polyfunctional phenolic compound *3

15

15.0

60

10

Oxetane compounds *4

10

5.0

-

-

Compounds containing oxetane rings *5

-

10.0

-

-

curing catalyst *6

5.0

5.0

2.0

5.4

Organic solvents *7

-

-

-

7.0

spherical silica

90.0

90.0

90.0

90.0

calcium carbonate

30.0

30.0

30.0

...

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Abstract

The present invention provides a thermosetting resin composition which has smaller solidification shrinking and excellent crack resistance and insulation reliability and the like properties, further the invention provides a thermosetting resin composition which has excellent sealing property between the condensate filled in the hole part and the cover coating layer. The thermosetting resin composition provided by the invention is characterized in that the composition comprises the following components: (A) epoxy resin, (B) polyfunctional phenolic compound, (C) solidifying catalyst, (D) filling agent and (E) the thermosetting resin composition of the oxetane compound; the invention also provides a thermosetting resin composition containing the compound which is showed by the general formula (I) and includes the oxazine ring group.

Description

technical field [0001] The present invention relates to a thermosetting resin composition used in the manufacture of a multilayer printed circuit board and a multilayer printed circuit board using the composition. More specifically, it relates to a liquid thermosetting resin composition which is useful as a composition for permanently filling via holes, through holes, etc. of printed circuit boards such as multilayer substrates and double-sided substrates, has less cure shrinkage, and is excellent in crack resistance And a multilayer printed circuit board using the composition. Background technique [0002] In recent years, printed circuit boards have been continuously developed in terms of thinner patterns and smaller mounting areas. Furthermore, in order to correspond to the miniaturization and high performance of devices equipped with printed circuit boards, it is desired to make printed circuit boards thinner and thinner. Therefore, the printed circuit board forms a res...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08G59/62C08L63/00C09D5/34C09D7/12C09D161/04C09D163/00H05K3/28
CPCA47G33/02A61G17/007A61G17/08
Inventor 山本理惠子有马圣夫
Owner TAIYO HLDG CO LTD
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