Photocurable and thermosetting resin composition and printed circuit boards made by using the same

A resin composition, thermosetting technology, applied in the directions of printed circuit, printed circuit manufacturing, printed circuit secondary treatment, etc., can solve the problems of unqualified adhesion of conductor layers, no discovery, etc., to prevent degradation and achieve excellent operability Effect

Active Publication Date: 2006-01-04
TAIYO INK MFG
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, in the heating process after the conductor layer is formed by electroless plating, electrolytic plating, etc., the volatile components generated by the interlayer

Method used

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  • Photocurable and thermosetting resin composition and printed circuit boards made by using the same
  • Photocurable and thermosetting resin composition and printed circuit boards made by using the same
  • Photocurable and thermosetting resin composition and printed circuit boards made by using the same

Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0086] Synthesis example 1 (synthesis of carboxyl group-containing photosensitive resin)

[0087] In a three-necked flask equipped with a thermometer, stirrer, dropping funnel, and reflux condenser, add 217 g (1.0 equiv.) of cresol novolac type epoxy resin and 204.8 g of carbitol acetate, wherein the epoxy resin is cyclic Oxygen equivalent was 217, and it had an average of 7 phenol core residues and epoxy groups in one molecule, and was dissolved by heating. To this mixture, 0.2 g of hydroquinone as a polymerization inhibitor and 1.0 g of triphenylphosphine as a catalyst were added, and then 72.0 g (1.0 equivalent) of acrylic acid was slowly added, and the mixture was reacted at 85 to 105° C. for 16 hours. Then, 91.2 g (0.67 equivalents) of tetrahydrophthalic anhydride was subjected to an addition reaction. The thus obtained varnish was a viscous liquid containing 35 parts of carbitol acetate, and was a carboxyl group-containing photosensitive resin having an acid value of 65...

Example Embodiment

[0088] Example 1 (the composition in which the component (B) is separated from the component (A) and (C))

[0089] To 100 parts of the carboxyl group-containing photosensitive resin as the component (A) obtained in Synthesis Example 1, 10 parts of dipentaerythritol hexaacrylate as the component (C) and 1 part of an antifoaming agent (Kyoeisha Oil Co., Ltd.) Production: AC-300), 80 parts of barium sulfate and 0.5 part of phthalocyanine green, and then blended and dispersed with a three-roll mill, the thus obtained composition was used as component A, and 5 parts were added as component (B) R represented by the aforementioned (IV) 2A photopolymerization initiator having an oxime bond having a methyl group, 1 part of (B-I) component of diethylthioxanthone (manufactured by Nippon Kayaku Co., Ltd.: カャキュア-DETX-S), 2.5 parts as (B-II) 4-Dimethylaminobenzoic acid ethyl ethyl ester (Nippon Kayaku Co., Ltd.: KADA-EPA) as component, 20 parts of cresol novolak-type epoxy resin (Nippon Ka...

Example Embodiment

[0090] Example 2 (composition in which component B is separated from component A and component C)

[0091] Except not using diethyl thioxanthone as the component (B-I) and ethyl 4-dimethylaminobenzoate as the component (B-II) in Example 1, according to the same procedures as in Example 1 Formulations and methods for preparing A and B components of a photocurable and thermally curable resin composition.

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Abstract

A photo- and thermo-setting resin composition comprising (A) a carboxyl-containing resin having at least one carboxyl group in the molecule, (B) a photopolymerization initiator having an oxime linkage represented by formula (I), (C) a reactive diluent, and (D) an epoxy compound having two or more epoxy groups in the molecule, wherein the initiator (B) and a combination of the resin (A) and the diluent (C) are incorporated in different formulations respectively to form an at least two-part system.

Description

technical field [0001] The present invention relates to a photocurable and thermosetting resin composition and a printed circuit board using the composition. More specifically, it relates to excellent dryness to the touch, adhesion, and resolution, and less mist during heat curing. A photocurable and heat-curable resin composition excellent in storage stability at high sensitivity; and a product manufactured using the composition, which can reduce gas generated during component mounting, PCT (Pressure Cooker Test) resistance, electrical insulation, etc. Printed circuit boards with solder resist and / or resin insulation. Background technique [0002] Solder resist compositions are used to prevent solder bridging and protect circuits when components are soldered to printed circuit boards. Therefore, their cured products are required to have various properties such as adhesion, chemical resistance, and electrical properties. In recent years, in the manufacturing industry of pri...

Claims

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Application Information

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IPC IPC(8): C08G59/40C08G59/68C08L63/00C08L101/08G03F7/004G03F7/038H05K3/28
CPCG03F7/0045G03F7/038C08L101/08C08G59/686H05K3/287C08L63/00C08L2666/02C08G59/22C08G59/40
Inventor 小岛秀明平井良学米田直树峰岸昌司宫部英和
Owner TAIYO INK MFG
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