Electret capacitor microphone

Abstract

An electret capacity microphone is prepared as spraying a lacquer insulation layer on external cylindrical surface of electrode ring ; setting paster electrode for sticking on microphone and printed circuit board on printed circuit board ; making metal shell opening end bend radially towards printed circuit board to keep fixed contact between back electrode board support component , back electrode board , insulation pad as well as vibration film plate and electrode ring as well as printed circuit board , applying material standing to temperature of sticking process to prepare electret film , insulation pad , vibration film plate , nonmetal model , electrode ring and lacquer insulation layer .

Description

technical field [0001] The present invention relates to a transducer for receiving sound waves for conversion into electrical signals representing the sound waves, and more particularly to an electret condenser microphone for use in various audio equipment such as portable telephones. Background technique [0002] A variety of electret microphones have been disclosed in the prior art, all of which are equipped with a capacitor unit composed of electrode plates and membranes for receiving sound waves for conversion into electrical signals representing the sound waves. [0003] On June 2, 1999, the Chinese patent disclosed a technical solution named "Electret Condenser Microphone" and the patent number is "97246455.7". Its basic structure is as follows Figure 9 Shown: the shell 72 and the cavity 76 of the microphone are made of metal materials with a through hole at the bottom and a cylindrical shape with an opening at one end. The plastic ring 75 and the spacer ring 77 are ci...

AI Technical Summary

Problems solved by technology

[0004] The shortcoming of above-mentioned technical scheme is: the structure of cavity 76 as one of electrode plate is complicated, has caused the difficulty in manufacture; Secondly, the setting of spacer ring 77 between cavity 76 and shell 72 causes assembly difficulty, If the assembly is to be successful, the isolation ring 77 needs to have a certain degree of elasticity; on the other hand, the failure temperature of the microphone assembly is greatly reduced, that is to say, during the assembly process of the microphone, the assembly temperature is higher than a certain value, and the microphone will fail

[0006] The traditional electret microphone, due to the limitations of its structure, material and manufacturing technology, cannot be welded with the host printed circuit board (PCB) through the reflow soldering process like other components, but can only be used as a separate device. The main reason for manual single-piece welding is that there are some plastic components in the traditional microphone material, and ordinary plastic materials cannot withstand high temperatures above 270°C. In addition, in the manufacturing process, the back plate needs to be charged. The ability of the pole diaphragm to store charges under high temperature conditions will decrease, thereby reducing the sensitivity of the microphone, which is why traditional microphones cannot be welded by SMT assembly technology (SMT), and manual single-piece welding is time-consuming and laborious. The quality is not guaranteed, therefore, the customer needs an electret microphone that can be adapted to the high temperature reflow soldering of the SMT process

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