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Leadless brazing filler metal containing cerium

A lead-free solder, mass percentage technology, applied in the direction of welding/cutting medium/material, welding medium, metal processing equipment, etc., can solve the problems of limited application and high alloy price

Active Publication Date: 2006-06-28
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the price of Sn-Ag-Cu alloy is relatively high, so the application is limited

Method used

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Examples

Experimental program
Comparison scheme
Effect test

specific Embodiment approach 2

[0012] According to the mass percentage ratio, its composition is: 3.0% copper (Cu), 0.01% nickel (Ni), 0.2% lead (Pb), 0.10% cerium (Ce), and the rest is tin (Sn).

[0013] The solidus temperature of the "lead-free solder containing cerium" obtained by the above composition ratio is about 225°C, and the liquidus temperature is about 240°C (experimental error is considered), and the commercially available flux (flux) is used in the Excellent wetting and spreading properties on copper, brass and PCB substrates.

specific Embodiment approach 3

[0014] According to the mass percentage ratio, its composition is: 0.7% copper (Cu), 0.01% nickel (Ni), 0.005% lead (Pb), 0.001% cerium (Ce), and the rest is tin (Sn).

[0015] The solidus temperature of the "lead-free solder containing cerium" obtained by the above composition ratio is about 227°C, and the liquidus temperature is about 240°C (experimental error is considered), and the commercially available flux (flux) is used in the Excellent wetting and spreading properties on copper, brass and PCB substrates.

specific Embodiment approach 4

[0016] According to the mass percentage ratio, its composition is: 0.7% copper (Cu), 0.1% nickel (Ni), 0.02% lead (Pb), 0.03% cerium (Ce), and the rest is tin (Sn).

[0017] The solidus temperature of the "lead-free solder containing cerium" obtained by the above composition ratio is about 227°C, and the liquidus temperature is about 240°C (experimental error is considered), and the commercially available flux (flux) is used in the Excellent wetting and spreading properties on copper, brass and PCB substrates.

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Abstract

A Ce contained Pb-free solder in the form of wire contains Cu (0.08-3.0 mass%), Ni (0.01-1.6), Pb (0.005-0.2), Ce (0.001-0.1) and Sn (rest). It is prepared from electrolytic Cu, Ni, Sn ingot, Pb ingot and Ce through proportional mixing, smelting, casting, extruding and drawing.

Description

1. Technical field [0001] The invention relates to a lead-free solder containing cerium, which belongs to brazing materials in the field of metal materials and metallurgy. 2. Background technology [0002] According to the WEEE and RoHS directives promulgated by the European Union, it is clearly proposed that the use of lead and several other toxic and harmful substances in household appliances will be restricted or banned from July 1, 2006, forcing the research on lead-free solder to enter the stage of practical application. Sn-Ag-Cu alloy has excellent wettability and mechanical properties, and is considered to be the most potential substitute of Sn-Pb solder. However, the price of Sn-Ag-Cu alloy is relatively high, so the application is limited. Sn-Cu-Ni solder has good application prospects due to its good comprehensive performance and moderate price. This invention "lead-free solder containing cerium" is completed under this technical background, and its comprehensive...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K35/26
Inventor 薛松柏
Owner NANJING UNIV OF AERONAUTICS & ASTRONAUTICS