Method of manufacturing ceramic laminate, laminated electronic element and method for producing same

A technology for laminated products and ceramics, applied in the manufacture of electrical components, laminated capacitors, multilayer circuits, etc., can solve problems such as weak connection strength and cracks, prevent delamination and cracks, improve adhesion, and inhibit deformation Effect

Inactive Publication Date: 2006-09-27
京陶瓷株式会社
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0017] Also, since the connection strength is weak at the interface between the dielectric ceramic layer and the inner electrode layer, when performing welding or performing a thermal shock test, the lamination Cracks appear in the periphery and end faces of the internal electrode layers of electronic components

Method used

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  • Method of manufacturing ceramic laminate, laminated electronic element and method for producing same
  • Method of manufacturing ceramic laminate, laminated electronic element and method for producing same
  • Method of manufacturing ceramic laminate, laminated electronic element and method for producing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0245] A laminated ceramic capacitor (a ceramic laminated product) was manufactured as follows.

[0246] To include 99.5mol% BaTiO 3 and 0.5 mol% MnO in 100 mol parts of the composition by adding 0.5 mol parts of Y 2 o 3 and 0.5 molar parts of MgO. To 100 parts by weight of this ceramic component was added 55% by weight of an excipient comprising 5.5% by weight of ethyl cellulose and 94.5% by weight of petroleum ethanol. The mixture was kneaded using a three-roll mill to prepare a ceramic slurry, which was then applied to a belt-shaped polyester carrier film by a die coater method to prepare a ceramic green sheet.

[0247] A conductive paste was prepared by kneading 45% by weight of nickel powder with a particle size of 0.2 μm and 55% by weight of excipients (including 5.5% by weight of ethyl cellulose and 94.5% by weight of petroleum ethanol) using a three-roll mill .

[0248] By pulverizing part of the above ceramic slurry until BaTiO 3 The particle size is 0.5 μm to pre...

Embodiment 2

[0270] Multilayer ceramic capacitors were fabricated by the method described below.

[0271] To include 99.5mol% BaTiO 3 and 0.5 mol% MnO to the composition of 100 mol parts by adding 0.5 mol parts of Y 2 o 3 and 0.5 molar parts of MgO. To 100 parts by weight of this ceramic component was added 55 parts by weight of an excipient comprising 5.5 percent by weight of polyvinyl butyral, 1.7 percent by weight of a plasticizer and 92.8 percent by weight of petroleum ethanol. The mixture was kneaded using a ball mill to prepare a ceramic slurry, which was then applied to a belt-shaped polyester carrier film by a die coater method to prepare a ceramic green sheet. The thickness of the ceramic green sheet was adjusted to about 2.5 microns.

[0272] A conductive powder was prepared by kneading 45% by weight of nickel powder with an average particle size of 0.2 microns and 55% by weight of excipients including 5.5% by weight of ethyl cellulose and 94.5% by weight of petroleum ethano...

Embodiment 3

[0299] Multilayer ceramic capacitors were fabricated by the method described below.

[0300] To 100 mole parts of the composition (comprising 99.5 mole % of BaTiO 3 and 0.5 mol% of MnO) adding 0.5 mol% of Y 2 o 3 and 0.5 mol% of MgO, and further adding glass powder with a certain softening point therein according to the amount shown in Table 3 to prepare a dielectric ceramic slurry. A dielectric ceramic green sheet having a thickness of 3 µm was prepared by applying the dielectric ceramic slurry to a tape-shaped polyester support film by a die coater method.

[0301] Because the particle size of the dielectric powder is affected by a large amount of BaTiO 3 Dominated by powder, so its average particle size is BaTiO 3 the average particle size.

[0302] Here, the dielectric powder used in the dielectric green sheet has an average particle diameter of about 0.4 microns, and the glass powder has an average particle diameter of about 0.7 microns and a softening point of 680°C...

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Abstract

The invention relates to a method for producing ceramic laminated product, wherein it comprises following steps: printing conductive slurry on the main surface of ceramic raw plate to form several conductive patterns with preset distances; the upper surface of ceramic raw plate between said conductive patterns and the upper surfaces of nearby conductive patterns are formed with organic resin film; using said conductive patterns, organic resin films and the ceramic raw plates to form temporary laminated products; when heating said temporary product at the fusion temperature of organic resin film, forming laminated product via compressing the temporary products. In addition, even the invention decreases the thickness of layer to increase the layer number, the thickness of conductive pattern will not make height difference, and it can restrain the deformation of product and restrain the resistance decrease and avoid short circuit.

Description

[0001] This application is a divisional application of the patent application with the application number 02130393.2 and the application date of May 25, 2002 and the same title. 1. Technical field [0002] The present invention relates to a method of manufacturing a ceramic laminate, a laminated electronic component and a method of manufacturing the same. In particular, the present invention relates to a method of manufacturing a ceramic laminate product in which a plurality of ceramic green sheets and conductive patterns having thinner layer thicknesses are stacked as in a wiring board or a laminated ceramic capacitor, and involves a plurality of thin ceramic layers Electronic components stacked together, and methods of manufacturing the same. 2. Background technology [0003] In recent years, along with the trend towards continued miniaturization and high density of electronic devices, there has been a push to provide small-sized laminated electronic components with reduce...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/00H01G4/00H01G4/12H01G4/30H05K3/46
Inventor 岩井田智广小泉成一
Owner 京陶瓷株式会社
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