Unlock instant, AI-driven research and patent intelligence for your innovation.

Oxygen doped firing of barium titanate on copper foil

A technology of firing zone and oxygen content, applied in the field of capacitors, can solve the problem of low insulation resistance of capacitors

Inactive Publication Date: 2006-10-18
EI DU PONT DE NEMOURS & CO
View PDF0 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For example, barium carbonate may lose oxygen in the crystal lattice, forming oxygen vacancies, resulting in lower insulation resistance of the capacitor

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Oxygen doped firing of barium titanate on copper foil
  • Oxygen doped firing of barium titanate on copper foil
  • Oxygen doped firing of barium titanate on copper foil

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0017] A method of improving the insulation resistance of thick film capacitors on copper foil is disclosed.

[0018] Capacitors fabricated according to the teachings of the present invention can have insulation resistance greater than 1 megohm and other desirable properties such as higher dielectric constant and lower dissipation factor.

[0019] Figures 1A-1D A method for fabricating single-layer capacitors on metal foil is shown. For illustration purposes, the cutaway shows only two capacitors. However, one, two, three or more capacitors can be formed on the foil according to the methods described in this invention. For the sake of brevity, the following description refers to the formation of only one illustrated capacitor.

[0020] exist Figure 1A , the metal foil 110 is formed. Metal foil 110 may be a material commonly available in the industry such as copper, copper-invar-copper, invar, nickel, nickel-coated copper, or other having a melting point in excess of the ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The present invention relates to a method of making an embedded capacitor and a printed wiring board and includes providing a metallic foil; forming a first dielectric layer over the metallic foil; forming a conductive layer over at least a portion of the first dielectric layer; controlling an oxygen content of a controlled atmosphere; and firing the first dielectric layer and the conductive layer in a firing zone in the controlled atmosphere.

Description

technical field [0001] The present invention generally relates to capacitors. In particular, the present invention relates to capacitors embedded in printed circuit boards, and more particularly to embedded capacitors made of thick film capacitors formed on copper foil. Background technique [0002] Installing embedded capacitors in printed circuit boards (PCBs) or printed wiring boards (PWBs) can reduce circuit size and improve circuit performance. Capacitors are typically embedded on boards that are stacked and connected by interconnect circuits, the stack of boards forming a printed circuit board. Laminates are often referred to as "inner laminates". [0003] Capacitors and other passive circuit components can be formed by firing-on-foil techniques and embedded in printed circuit boards. One or more "fired-on-foil" capacitors are produced by depositing a layer of thick film capacitor material on a metal foil substrate, followed by depositing a top electrode on the laye...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H01G4/33H01G4/12H01G13/00H01L23/12H05K1/16H05K3/30
CPCH01G4/1227H05K1/092H05K1/162H05K3/1291H05K2201/017H05K2201/0355H05K2201/09763H05K2203/1126Y10T428/24917H01G4/018H01G4/228
Inventor W·J·博兰
Owner EI DU PONT DE NEMOURS & CO