Use of decamethylene diamine in preparing copolyamide hot sol

A technology of copolyamide and hot melt adhesive, applied in the direction of adhesives, etc., can solve the problem of high cost, and achieve the effect of reducing production cost, convenient operation and simplifying process flow

Active Publication Date: 2006-12-27
WUXI YINDA NYLON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Copolyamide hot melt adhesives produced abroad generally contain nylon-11 or nylon-12 monomers, the proportion can reach more than 50-60%, and the relative cost is relatively high

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0026] The raw material ratio is as follows:

[0027] Decanediamine, sebacic acid 45 mass ratio (equal molar ratio of sebacic acid and decanediamine)

[0028] Caprolactam 30 mass ratio

[0029] Nylon 66 salt 25 mass ratio (or equimolar ratio of hexamethylenediamine and adipic acid added)

[0030] Benzoyl ≤5‰

[0031] Appropriate amount of water, antioxidant 1010, phosphorous acid, etc.

[0032] Feed according to the above ratio, vacuumize to -0.098Mpa, replace with nitrogen three times, raise the temperature to 230°C, the pressure is 1.4Mpa, keep the pressure for 2 hours, slowly reduce the pressure, drop to normal pressure within 3 hours, and the temperature rises to 240°C, Continue to react for 2 hours, discharge, water-cooled and pelletized to obtain copolyamide hot-melt adhesive resin. The index detection results are:

[0033] Melting point: 110-120°C

[0034] Melt index: ≥30g / 10min

[0035] Molecular weight: 18000-20000

[0036] Relative viscosity: 1.8

Embodiment 2

[0038] The raw material ratio is as follows:

[0039] Decanediamine, sebacic acid 35 mass ratio (equal molar ratio of sebacic acid and decanediamine)

[0040] Nylon 610 salt 15 mass ratio (or equimolar ratio of hexamethylenediamine and sebacic acid)

[0041] Nylon 66 salt 20 mass ratio

[0042] Caprolactam 30 mass ratio

[0043] Appropriate amount of water, antioxidant 1010, phosphorous acid, etc.

[0044] Feed according to the above ratio, vacuumize to -0.098Mpa, replace with nitrogen three times, raise the temperature to 220°C, the pressure is 1.3Mpa, keep the pressure for 2.5 hours, slowly reduce the pressure, drop to normal pressure within 3 hours, and the temperature rises to 230°C, Continue to react for 2.5 hours, discharge, water-cooled and pelletized to obtain copolyamide hot-melt adhesive resin. The index detection results are:

[0045] Melting point: 100-110°C

[0046] Melt index: ≥40g / 10min

[0047] Molecular weight: 15000-18000

[0048] Relative viscosity: ...

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Abstract

The invention relates the diamine product used to produce copolyamide hot melt adhesive. The method comprises the following steps: 1. using decanamine to prepare hot melt adhesive; 2. the copolymerization hot melt adhesive being ternary or polyvalent; 3. the copolymerization hot melt adhesive comprising a, b elementary units, a: two or many C6-13 diamine or two or many C6-13 dibasic acid, b: aminocaprolactam or aminoadipic acid; 4. 60-80% a and 20-40% b. The decanamine belongs to a. The invention has the advantages of simple technology, low cost, and easy operation.

Description

technical field [0001] The invention relates to the application of a class of long carbon chain diamine products in the preparation of copolyamide hot-melt adhesives, in particular the application of decane diamine products in the preparation of copolyamide hot-melt adhesives. Background technique [0002] Copolyamide hot melt adhesive is also called nylon hot melt adhesive. It is a thermoplastic nylon resin compounded with polyamide resin as the matrix and other auxiliary components. The outstanding advantages of copolyamide hot melt adhesives are: low melting temperature, narrow melting point range, strong polarity, high bonding strength, good processing performance, good wear resistance, strong chemical resistance, good flexibility and washing resistance properties, etc., so that it occupies a considerable market in the field of fiber fabric bonding, and is often used in fusible interlinings, leather fusible interlinings, shoes and hats, etc., and is also widely used in ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J177/06
Inventor 殷新中
Owner WUXI YINDA NYLON
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