Silicone adhesive agent

An adhesive, siloxane technology, applied in the directions of adhesives, non-polymer adhesive additives, adhesive additives, etc., can solve the problem of reduced bonding between semiconductor chips and bonding wires or lead frames and bonding wires Reduced device reliability, etc.

Inactive Publication Date: 2007-01-10
迈图高新材料日本控股有限责任公司
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Problems solved by technology

[0003] However, in the technology of the above-mentioned Japanese Patent Application Laid-Open No. 61-55300, there is the following problem: after bonding the semiconductor chip and the lead plate with silicone rubber, when the semiconductor chip and the lead frame are connected with a bonding wire such as a wire, the semiconductor The bondability (wire bondability) between the sheet and the bonding wire or between the lead frame and the bonding wire decreases, thereby reducing the reliability of the semiconductor device

Method used

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Embodiment Construction

[0011] Hereinafter, the present invention will be described in detail. The present invention is a silicone adhesive for bonding a semiconductor chip and a mounting member of the chip, characterized in that it contains an additive that contaminates a glass plate during heat curing so that the contact angle on the glass plate is 70° or less A reaction-curable silicone rubber composition, and examples of such an addition reaction-curable silicone rubber composition include:

[0012] Addition reaction-curable silicone rubber composition (hereinafter referred to as composition 1 of the present invention) comprising:

[0013] (A) polyorganosiloxane having 2 or more silicon atom-bonded alkenyl groups in 1 molecule, 100 parts by weight;

[0014] (B) Polyorganosiloxane having a heating loss of 5% by weight or less at 100°C x 1 hour and having two or more silicon-bonded hydrogen atoms in one molecule, for one chain of component (A) The alkenyl group is sufficient to provide 0.5 to 3 s...

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Abstract

A silicone adhesive agent for joining a semiconductor pellet and a member for mounting said pellet, which comprises a addition reaction curing type silicone rubber composition exhibiting a stain onto a glass plate during curing by heating of a contact angle on the glass of 70° or less. The silicone adhesive agent does not lower the wire bondability and also does not lower the adhesion between the surface of a semiconductor pellet or a lead frame and a scaling resin.

Description

technical field [0001] The present invention relates to a silicone adhesive (mold adhesive) for bonding a semiconductor chip to a semiconductor chip mounting member such as a tab. Background technique [0002] A semiconductor device is a structure in which, for example, a silicon-containing semiconductor chip and a semiconductor chip such as a lead plate as its support are bonded using an adhesive (mold adhesive) such as epoxy resin or polyimide resin. A mounting member is bonded, a semiconductor chip is electrically connected to a metal lead frame, and their integration is sealed with a sealing resin such as epoxy resin. In view of problems such as cracks caused by the use of conventional mold adhesives, a semiconductor device using a silicone adhesive to bond a semiconductor chip and a tab has been proposed (JP-A-61-55300). This is a device that uses silicone rubber elastomer to moderate internal deformation caused by the difference in thermal expansion coefficient betwee...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/52C09J183/07C09J11/04C09J183/04C09J201/00H01L23/495
CPCH01L2924/01027H01L24/29H01L2224/73265H01L2224/48624H01L2924/15747H01L2924/01015H01L23/49513H01L2224/48091H01L2924/078H01L2924/01006H01L2924/01078H01L24/48H01L2924/01079H01L2224/32245H01L24/45H01L2924/01005H01L2924/01082H01L2224/45144H01L2924/01013H01L2224/85207H01L2924/01029H01L2224/48247H01L2224/48599H01L2224/05624H01L24/32H01L2924/01019H01L2924/01033H01L2924/181H01L2924/00014H01L2924/3512H01L2924/00H01L2924/00012H01L21/52H01L23/495C09J183/04
Inventor 田村长平井信男
Owner 迈图高新材料日本控股有限责任公司
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