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Adhesive agent for circuit member connection, circuit board and its producing method

A technology for circuit components and adhesives, which is applied in semiconductor/solid-state device manufacturing, circuits, electrical components, etc., and can solve problems such as poor conduction, increased connection resistance, and adhesive peeling.

Inactive Publication Date: 2007-01-24
HITACHI CHEM CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, when a chip inserted with an anisotropic conductive adhesive is directly mounted on a substrate, in the temperature cycle test, stress will be generated at the connection part due to the difference in thermal expansion coefficient between the chip and the substrate. Therefore, when performing a thermal shock test, During reliability tests such as PCT (Pressure Cooking Test) and solder bath immersion test, problems such as increased connection resistance and peeling of the adhesive occurred.
In addition, when the bump electrodes are formed on the connection terminals of the chip, in the reliability test, the stress generated based on the difference in thermal expansion coefficient between the chip and the substrate is concentrated on the interface between the bump electrodes and the chip, and the bump electrodes are separated from the chip electrode interface. Peeling, poor conduction and other problems

Method used

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  • Adhesive agent for circuit member connection, circuit board and its producing method
  • Adhesive agent for circuit member connection, circuit board and its producing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0074] Acrylic rubber obtained by copolymerizing 50 g of phenoxy resin, butyl acrylate (40 parts), ethyl acrylate (30 parts), acrylonitrile (30 parts) and glycidyl methacrylate (3 parts) ) 125g, dissolved in 400g of ethyl acetate to obtain a 30% solution.

[0075] Then, add 325 g of liquid epoxy resin (epoxy equivalent: 185) containing microcapsule type latent curing agent to the above solution, stir, add fused silica (average Particle size: 0.5 μm) 40 parts, and nickel particles (diameter: 3 μm 2% by volume) were dispersed therein to prepare a solution for film coating.

[0076] The film coating solution was applied on a release film (polyethylene terephthalate film treated with silicone, thickness: 40 μm) with a rubber roller, and dried at 100° C. for 10 minutes to form a thickness 45 μm adhesive film a. The modulus of elasticity at 40° C. of the adhesive resin composition in which fused silica and nickel particles were removed from the adhesive film a was 800 MPa as measu...

Embodiment 2

[0081] Acrylic rubber obtained by copolymerizing 50 g of phenoxy resin, butyl acrylate (40 parts), ethyl acrylate (30 parts), acrylonitrile (30 parts) and glycidyl methacrylate (3 parts) (molecular weight: 85 ten thousand) 175g, dissolved in 525g of ethyl acetate to obtain a 30% solution.

[0082] Then, add 275 g of liquid epoxy resin (epoxy equivalent: 185) containing microcapsule type latent curing agent to the above solution, stir, and add fused silica (average particle size) to 100 parts (weight) of the bonding resin composition. Diameter: 0.5 μm) 60 parts by weight, and nickel particles (diameter: 5 μm) 2% by volume were dispersed therein to prepare a film coating solution.

[0083] The film coating solution was applied on a release film (polyethylene terephthalate film treated with silicone, thickness: 40 μm) with a rubber roller, and dried at 100° C. for 10 minutes to form a thickness of 45 μm. The adhesive film b. The elastic modulus at 40° C. of the adhesive resin c...

Embodiment 3

[0088]Acrylic rubber obtained by copolymerizing 50 g of phenoxy resin, butyl acrylate (40 parts), ethyl acrylate (30 parts), acrylonitrile (30 parts) and glycidyl methacrylate (3 parts) (molecular weight: 85 Ten thousand) 100g was dissolved in ethyl acetate 350g to obtain a 30% solution.

[0089] Then, add 350 g of liquid epoxy resin (epoxy equivalent: 185) containing a microcapsule type latent curing agent to the above solution, stir, and add fused silica (average particle size) to 100 parts (weight) of the bonding resin composition. Diameter: 0.5 μm) 60 parts (by weight), and 5% (volume) of conductive particles forming the Au layer were dispersed on the surface of the polystyrene core material (diameter: 5 μm) to prepare a film coating solution.

[0090] The film coating solution was applied on a release film (polyethylene terephthalate film treated with silicone, thickness: 40 μm) with a rubber roller, and dried at 100° C. for 10 minutes to form a thickness 45 μm adhesive ...

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Abstract

The present invention provides a kind of adhesive for connecting circuit members, which is used for the electric connection between the opposite circuit electrodes white pressurizing. The adhesive contains adhering resin composition and inorganic stuffing, or is one double layer structure with one first adhesive layer and one second adhesive layer. The present invention also provides circuit board with the adhesive connected circuit members and its making process.

Description

[0001] This application is a divisional application of the Chinese application whose application number is CN200410097888.1 (the application date is August 13, 1998), and the invention title is "Adhesive for connecting circuit components, circuit board and its manufacturing method". The applicant is a divisional application of a PCT application entering the national phase with application number CN98814271.6 (the international filing date is August 13, 1998). technical field [0002] The present invention relates to, for example, an adhesive for connecting circuit members used for bonding and fixing a semiconductor chip and a substrate by a flip-chip mounting method, and at the same time electrically connecting two electrodes to each other, and circuit members. Connected circuit board and method of manufacture thereof. Background technique [0003] In the field of semiconductor mounting, flip-chip mounting, in which IC (integrated circuit) chips are directly mounted on print...

Claims

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Application Information

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IPC IPC(8): C09J11/04H01L21/60
CPCH01L2924/01005H01L2224/2919
Inventor 渡边伊津夫竹村贤三永井朗井坂和博渡边治小岛和良
Owner HITACHI CHEM CO LTD
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