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Package structure and method for thermo-optical switch array/modulator

A thermo-optic modulator and thermo-optic switch technology, which is applied in the field of device packaging, can solve the problems of expensive needs, expensive integrated circuit chips, and poor heat dissipation.

Inactive Publication Date: 2007-03-14
INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Although the above-mentioned flip-chip packaging method has good packaging integration, the entire packaging process is complicated and the pass rate is difficult to control
and require expensive flip-chip equipment
It is also very expensive to prepare integrated circuit chips, and the process cost is very high
In addition, when the thermo-optic switch array / modulator chip area is relatively large, the heat dissipation effect of this packaging method is not good

Method used

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  • Package structure and method for thermo-optical switch array/modulator
  • Package structure and method for thermo-optical switch array/modulator
  • Package structure and method for thermo-optical switch array/modulator

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Embodiment Construction

[0049] Please refer to FIG. 2 to FIG. 4 , which show the structure of the selected embodiment of the present invention.

[0050] The present invention relates to a packaging structure of thermo-optic switch array / modulator and its packaging method. The main part of the structure is a printed circuit board with a metal heat dissipation area and a control circuit pattern.

[0051] Figure 2 shows an overall schematic of the package structure. After the thermo-optic switch array / modulator chip 100 is coupled with the optical fiber array 102, it is pasted on the heat dissipation metal area 205 of the printed circuit board 201 by using a colloid with good thermal conductivity and electrical insulation. The drive circuit has been formed on the printed circuit board 201 The pattern, the electrode 103a of the thermo-optic switch array / modulator chip 100 and the output electrode 202 of the printed circuit board are electrically connected by pressure welding, and the control circuit is c...

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Abstract

The related package for thermal-optical switch array / modulator comprises: configuring and fixing the target chip on a PCB by colloid; keeping a heat dissipation metal area on one side of PCB to cover whole board by routing gap; except former area, using other surface part of the PCB to form the control and drive circuit for the target chip; using through hole to complete the circuit connection between upper an lower layers; arranging contact electrodes near the metal area to pressure weld with the target chip. This invention has well heat dissipation effect with simple technique and well operation reliability.

Description

technical field [0001] The invention relates to the technical field of device packaging, in particular to a packaging structure of a thermo-optic switch array / modulator and a packaging method thereof. Background technique [0002] Dense Wavelength Division Multiplexing (DWDM) technology is an effective method to solve broadband and large-capacity optical fiber network communication. Thermo-optic switch / modulator is the key component of constructing DWDM system. Due to the fast speed of thermo-optic switches, simple manufacturing process, and good integration, the trend of its practical application is becoming more and more obvious. At present, the silica-based thermo-optic switch array of NTT Corporation of Japan has been put into commercial use, and a large number of silica, polymer and SOI thermo-optic modulators have also entered the practical track. However, in order to improve the stability of the thermo-optic switch array / modulator and improve its optical performance...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B6/35H04J14/02H04B10/12
Inventor 李运涛陈少武余金中
Owner INST OF SEMICONDUCTORS - CHINESE ACAD OF SCI
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