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Semiconductor encapsulating epoxy resin composition and semiconductor device

A technology of epoxy resin and semiconductor, which is applied in the direction of semiconductor devices, semiconductor/solid device components, electric solid devices, etc., can solve the problems of insulating film sealing resin cracks, low mechanical strength, peeling, etc., and achieve good warping characteristics, Excellent temperature cycle performance and excellent humidity resistance reliability

Inactive Publication Date: 2007-05-16
SHIN ETSU CHEM IND CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] For example, ball grid array (BGA) or QFN with excellent high-density mountability has gradually become the mainstream of IC or LSI in recent years, but since the package is only sealed on one side of the package, warpage after molding has become a serious problem
[0005] In addition, with the miniaturization of the LSI manufacturing process, the development of low-permittivity interlayer insulating films with lower relative permittivity (1.1 to 3.8) has been developed. Although silicon oxide films added with impurities such as SiOF, organic high Molecular film, porous silicon dioxide, etc. are used as low dielectric constant interlayer insulating films, but due to their low mechanical strength, the following serious problems arise during solder reflow (handa rivulo one) or subsequent temperature cycles : Delamination occurs at the interface between the sealing material and the low dielectric constant interlayer insulating film, or cracks occur inside the low dielectric constant interlayer insulating film or on the sealing resin

Method used

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  • Semiconductor encapsulating epoxy resin composition and semiconductor device
  • Semiconductor encapsulating epoxy resin composition and semiconductor device
  • Semiconductor encapsulating epoxy resin composition and semiconductor device

Examples

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preparation example Construction

[0078] [Preparation of epoxy resin composition, etc.]

[0079]As a general method for preparing the sealing resin composition of the present invention into a molding material, epoxy resin, curing agent, silicon dioxide, and other additives can be mixed in a prescribed composition ratio, and after being fully mixed with a mixer, etc., Melt and mix with hot rollers, kneaders, extruders, etc., then cool and solidify, crush to an appropriate size, and make molding materials. In addition, when the composition is fully mixed with a mixer or the like, it is preferable to make it wet by surface treatment with a silane coupling agent or the like in order to obtain better storage stability.

[0080] Here, examples of the silane coupling agent include γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropylmethyldiethoxysilane, γ-glycidoxypropyltriethoxysilane, and γ-glycidoxypropyltrimethoxysilane. Oxysilane, p-Styryltrimethoxysilane, γ-Methacryloxypropylmethyldimethoxysilane, γ-Methacrylo...

Embodiment 1～10

[0084] "Examples 1-10, Comparative Examples 1-6"

[0085] The components shown in Table 1 were melt-mixed until uniform using a hot twin-roller, cooled and pulverized to obtain an epoxy resin composition for semiconductor sealing. The raw materials used are as follows.

[0086] (epoxy resin)

[0087] Among the epoxy resins of the above formula (1), for the epoxy resins (i) to (iii) of the following structures having different m and n values, epoxy resins (1) to (iii) as shown in Table 1 are used in accordance with their compounding ratios. (4) and (5) biphenyl arane epoxy resin (NC3000: manufactured by Nippon Kayaku Co., Ltd., brand name). G is the same as above.

[0088] Epoxy resin (i) (m=0, n=0)

[0089] [chemical formula 10]

[0090]

[0091] Epoxy resin (ii) (n=0 when m=1, n=1 when m=0)

[0092] [chemical formula 11]

[0093]

[0094] Epoxy resin (iii) (m=1, n=1)

[0095] [chemical formula 12]

[0096]

[0097] [Table 1]

[0098] Epoxy Resin ...

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PUM

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Abstract

An epoxy resin composition comprising (A) a naphthalene type epoxy resin in which 35-85 parts by weight of 1,1-bis(2-glycidyloxy-1-naphthyl)alkane and 1-35 parts by weight of 1,1-bis(2,7-diglycidyloxy-1-naphthyl)alkane are included per 100 parts by weight of the resin, (B) a phenolic resin curing agent, (C) a copolymer obtained through addition reaction of alkenyl groups on an alkenyl-containing epoxy compound and SiH groups on an organohydrogenpolysiloxane of 20 to 50 silicon atoms, and (D) an inorganic filler is best suited for semiconductor encapsulation because the cured composition has good thermal cycling, anti-warping, reflow resistance, and moisture-proof reliability.

Description

technical field [0001] The present invention relates to an epoxy resin composition for semiconductor sealing, and a semiconductor device sealed with a cured product of the resin composition. A semiconductor element is mounted on one surface of the semiconductor component, and only the surface of the resin substrate surface and the metal substrate surface on which the semiconductor element is mounted is substantially sealed. Re-leveling (reflow) and moisture resistance reliability. Background technique [0002] Previously, semiconductor devices were dominated by resin-sealed diodes, transistors, ICs, LSIs, and super LSIs. Compared with other thermosetting resins, epoxy resins have excellent moldability, adhesiveness, electrical properties, mechanical properties, and moisture resistance. Therefore, epoxy resin compositions are generally used to seal semiconductor devices. [0003] However, in recent years, along with the miniaturization, weight reduction, and high performanc...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09K3/10C08L63/00H01L23/29
CPCC08G59/3218C08G77/42C08L83/10C08G59/3254H01L23/293C08G59/621H01L2924/0002H01L2924/00H01L23/02
Inventor 浅野英一木村靖夫
Owner SHIN ETSU CHEM IND CO LTD
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