Photosensitive resin composition for organic light emitting diodes
A technology of photosensitive resin and composition, which is applied in the field of science and technology, can solve the problems of reduced numerical aperture and long process time, and achieve the effect of increasing numerical aperture, shortening process time and excellent performance
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Embodiment 1
[0070] (manufacturing novolac resin)
[0071] 45 g of m-cresol, 55 g of p-cresol, 65 g of formaldehyde, and 0.5 g of oxalic acid were added to an overhead mixer and stirred to prepare a homogeneous mixture. The homogeneous mixture was heated at 95°C and maintained at this temperature for 4 hours. The reflux condenser was replaced by a distillation apparatus, and the temperature of the homogeneous mixture was controlled at 110° C. for 2 hours for distillation. Vacuum distillation was carried out at 180° C. for 2 hours to remove residual monomers, and the molten novolac resin was cooled at room temperature. Thereafter, the weight average molecular weight was measured by GPC to obtain a novolak resin having a weight average molecular weight of 3,500. In this case, the weight average molecular weight is a polystyrene conversion average molecular weight measured using GPC.
[0072] (Manufacture of 1,2-quinonediazide compound)
[0073] Make 1 mole of 4,4'-[1-[4-[1-[4-hydroxyphen...
Embodiment 2
[0077] When polymerizing the novolak resin in said embodiment 1, as a monomer, use 70g m-cresol and 30g xylenol to replace 45g m-cresol and 55g p-cresol, in addition, adopt and described embodiment 1 The photosensitive resin composition was produced in the same manner.
Embodiment 3
[0079] When polymerizing the novolak resin in said embodiment 1, as a monomer, use 35g m-cresol, 40g p-cresol and 25g xylenol to replace 45g m-cresol and 55g p-cresol, in addition, use A photosensitive resin composition was produced in the same manner as in Example 1.
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Abstract
Description
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Application Information
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